Issued Patents All Time
Showing 1–17 of 17 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 12027496 | Film in substrate for releasing z stack-up constraint | Jianfeng Hu, Yong She, Zhijun Xu | 2024-07-02 |
| 11990395 | Joint connection of corner non-critical to function (NCTF) ball for BGA solder joint reliability (SJR) enhancement | Xiaoying Tang, Bin Liu, Yong She, Zhijun Xu | 2024-05-21 |
| 11894344 | Power enhanced stacked chip scale package solution with integrated die attach film | Zhijun Xu, Bin Liu, Yong She | 2024-02-06 |
| 11848281 | Die stack with reduced warpage | Yong She, Bin Liu, Aiping Tan | 2023-12-19 |
| 11830848 | Electronic device package | Bin Liu, Yong She, Hyoung Il Kim | 2023-11-28 |
| 11742284 | Interconnect structure fabricated using lithographic and deposition processes | Bin Liu, Yong She, Zhijun Xu | 2023-08-29 |
| 11538746 | Vertical bond-wire stacked chip-scale package with application-specific integrated circuit die on stack, and methods of making same | Yong She, Bin Liu, Aiping Tan, Li Deng | 2022-12-27 |
| 11302671 | Power enhanced stacked chip scale package solution with integrated die attach film | Zhijun Xu, Bin Liu, Yong She | 2022-04-12 |
| 11148044 | Input device for intelligent terminal | Haitao Duan, Peng Li | 2021-10-19 |
| 11101254 | Flip-chip like integrated passive prepackage for SIP device | Bin Liu | 2021-08-24 |
| 11081451 | Die stack with reduced warpage | Yong She, Bin Liu, Aiping Tan | 2021-08-03 |
| 10991679 | Stair-stacked dice device in a system in package, and methods of making same | Bin Liu, Yong She, Aiping Tan, Li Deng | 2021-04-27 |
| 10930622 | Prepackaged stair-stacked memory module in a chip scale system in package, and methods of making same | Bin Liu, Yong She, Aiping Tan, Li Deng | 2021-02-23 |
| 10910347 | Method, apparatus and system to interconnect packaged integrated circuit dies | Yong She, John G. Meyers, Richard Patten | 2021-02-02 |
| 10770434 | Stair-stacked dice device in a system in package, and methods of making same | Bin Liu, Yong She, Aiping Tan, Li Deng | 2020-09-08 |
| 10727208 | Prepackaged stair-stacked memory module in a chip scale system in package, and methods of making same | Bin Liu, Yong She, Aiping Tan, Li Deng | 2020-07-28 |
| 10396055 | Method, apparatus and system to interconnect packaged integrated circuit dies | Yong She, John G. Meyers, Richard Patten | 2019-08-27 |