| 11848281 |
Die stack with reduced warpage |
Yong She, Bin Liu, Zhicheng Ding |
2023-12-19 |
| 11652087 |
Interposer design in package structures for wire bonding applications |
— |
2023-05-16 |
| 11538746 |
Vertical bond-wire stacked chip-scale package with application-specific integrated circuit die on stack, and methods of making same |
Zhicheng Ding, Yong She, Bin Liu, Li Deng |
2022-12-27 |
| 11081451 |
Die stack with reduced warpage |
Yong She, Bin Liu, Zhicheng Ding |
2021-08-03 |
| 10991679 |
Stair-stacked dice device in a system in package, and methods of making same |
Zhicheng Ding, Bin Liu, Yong She, Li Deng |
2021-04-27 |
| 10971478 |
Interposer design in package structures for wire bonding applications |
— |
2021-04-06 |
| 10930622 |
Prepackaged stair-stacked memory module in a chip scale system in package, and methods of making same |
Zhicheng Ding, Bin Liu, Yong She, Li Deng |
2021-02-23 |
| 10770434 |
Stair-stacked dice device in a system in package, and methods of making same |
Zhicheng Ding, Bin Liu, Yong She, Li Deng |
2020-09-08 |
| 10727208 |
Prepackaged stair-stacked memory module in a chip scale system in package, and methods of making same |
Zhicheng Ding, Bin Liu, Yong She, Li Deng |
2020-07-28 |