Aiping Tan — 9 Patents at Intel

Aiping Tan has been granted 9 US patents while listed as an inventor at Intel. The first was granted in 2020 and the most recent in December 2023. Aiping Tan ranks #535,341 of 4,157,543 US inventors in our database (top 12.9%). Patent records list Aiping Tan in Shanghai, CN.

Issued Patents All Time

Showing 1–9 of 9 patents

Patent #	Title	Co-Inventors	Date	Approx Value ⓘ
11848281	Die stack with reduced warpage	Yong She, Bin Liu, Zhicheng Ding	2023-12-19	$50,836,000
11652087	Interposer design in package structures for wire bonding applications	—	2023-05-16
11538746	Vertical bond-wire stacked chip-scale package with application-specific integrated circuit die on stack, and methods of making same	Zhicheng Ding, Yong She, Bin Liu, Li Deng	2022-12-27	$12,365,000
11081451	Die stack with reduced warpage	Yong She, Bin Liu, Zhicheng Ding	2021-08-03	$25,424,000
10991679	Stair-stacked dice device in a system in package, and methods of making same	Zhicheng Ding, Bin Liu, Yong She, Li Deng	2021-04-27	$44,593,000
10971478	Interposer design in package structures for wire bonding applications	—	2021-04-06	$36,336,000
10930622	Prepackaged stair-stacked memory module in a chip scale system in package, and methods of making same	Zhicheng Ding, Bin Liu, Yong She, Li Deng	2021-02-23	$31,062,000
10770434	Stair-stacked dice device in a system in package, and methods of making same	Zhicheng Ding, Bin Liu, Yong She, Li Deng	2020-09-08	$26,363,000
10727208	Prepackaged stair-stacked memory module in a chip scale system in package, and methods of making same	Zhicheng Ding, Bin Liu, Yong She, Li Deng	2020-07-28	$26,273,000

Aiping Tan — 9 Patents

Issued Patents All Time

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