Li Deng — 6 Patents at Intel | Patent Leaderboard

Li Deng has been granted 6 US patents while listed as an inventor at Intel. The first was granted in 2009 and the most recent in December 2022. Li Deng ranks #779,687 of 4,157,543 US inventors in our database (top 18.8%). Patent records list Li Deng in Nanhu, CN.

Issued Patents All Time

Showing 1–6 of 6 patents

Patent #	Title	Co-Inventors	Date	Approx Value ⓘ
11538746	Vertical bond-wire stacked chip-scale package with application-specific integrated circuit die on stack, and methods of making same	Zhicheng Ding, Yong She, Bin Liu, Aiping Tan	2022-12-27	$12,365,000
10991679	Stair-stacked dice device in a system in package, and methods of making same	Zhicheng Ding, Bin Liu, Yong She, Aiping Tan	2021-04-27	$44,593,000
10930622	Prepackaged stair-stacked memory module in a chip scale system in package, and methods of making same	Zhicheng Ding, Bin Liu, Yong She, Aiping Tan	2021-02-23	$31,062,000
10770434	Stair-stacked dice device in a system in package, and methods of making same	Zhicheng Ding, Bin Liu, Yong She, Aiping Tan	2020-09-08	$26,363,000
10727208	Prepackaged stair-stacked memory module in a chip scale system in package, and methods of making same	Zhicheng Ding, Bin Liu, Yong She, Aiping Tan	2020-07-28	$26,273,000
7587976	Printing apparatus having fixing mechanism including air pipe assembly	Chia-Hsing Chang, Jia-Wu Xiong, Hui Meng, Qin Liu, Hong Ma	2009-09-15

Li Deng — 6 Patents

Issued Patents All Time

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