Issued Patents All Time
Showing 1–6 of 6 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 11538746 | Vertical bond-wire stacked chip-scale package with application-specific integrated circuit die on stack, and methods of making same | Zhicheng Ding, Yong She, Bin Liu, Aiping Tan | 2022-12-27 |
| 10991679 | Stair-stacked dice device in a system in package, and methods of making same | Zhicheng Ding, Bin Liu, Yong She, Aiping Tan | 2021-04-27 |
| 10930622 | Prepackaged stair-stacked memory module in a chip scale system in package, and methods of making same | Zhicheng Ding, Bin Liu, Yong She, Aiping Tan | 2021-02-23 |
| 10770434 | Stair-stacked dice device in a system in package, and methods of making same | Zhicheng Ding, Bin Liu, Yong She, Aiping Tan | 2020-09-08 |
| 10727208 | Prepackaged stair-stacked memory module in a chip scale system in package, and methods of making same | Zhicheng Ding, Bin Liu, Yong She, Aiping Tan | 2020-07-28 |
| 7587976 | Printing apparatus having fixing mechanism including air pipe assembly | Chia-Hsing Chang, Jia-Wu Xiong, Hui Meng, Qin Liu, Hong Ma | 2009-09-15 |