| 11538746 |
Vertical bond-wire stacked chip-scale package with application-specific integrated circuit die on stack, and methods of making same |
Zhicheng Ding, Yong She, Bin Liu, Aiping Tan |
2022-12-27 |
| 10991679 |
Stair-stacked dice device in a system in package, and methods of making same |
Zhicheng Ding, Bin Liu, Yong She, Aiping Tan |
2021-04-27 |
| 10930622 |
Prepackaged stair-stacked memory module in a chip scale system in package, and methods of making same |
Zhicheng Ding, Bin Liu, Yong She, Aiping Tan |
2021-02-23 |
| 10770434 |
Stair-stacked dice device in a system in package, and methods of making same |
Zhicheng Ding, Bin Liu, Yong She, Aiping Tan |
2020-09-08 |
| 10727208 |
Prepackaged stair-stacked memory module in a chip scale system in package, and methods of making same |
Zhicheng Ding, Bin Liu, Yong She, Aiping Tan |
2020-07-28 |
| 7587976 |
Printing apparatus having fixing mechanism including air pipe assembly |
Chia-Hsing Chang, Jia-Wu Xiong, Hui Meng, Qin Liu, Hong Ma |
2009-09-15 |