Patent Leaderboard
USPTO Patent Rankings Data through Dec 31, 2025
Home › Interconnect structure fabricated using lithographic and deposition processes

Interconnect structure fabricated using lithographic and deposition processes

US Patent 11742284 · Granted Aug 29, 2023

Estimated economic value: $19,273,000 ⓘ

Assignee

Inventors

View full patent text on Google Patents →

More Patents by These Inventors

Chip transfer method and electronic device2025
Plastic recycling system using solvent-targeted recovery and precipitation (STRA2025
Method and internet of things (IoT) system for managing gas data2025
Industrial internet of things with sensing network platform in post-sub-platform2025
Methods and internet of things systems for processing work orders of gas platfor2025
Method and internet of things system of charging information recommendation for 2025
Intelligent manufacturing methods and systems based on Industrial Internet of Th2025
Realizing the nano-amorphous state of materials inside nano-porous templates2025
Methods and smart gas internet of things systems for determining gas abnormity f2025
Methods and internet of things (IoT) systems for abnormality troubleshooting at 2025
Method for gas pipeline network supervision based on smart gas and internet of t2025
1H-imidazo[4,5-h]quinazoline compound as protein kinase inhibitor2025