Issued Patents All Time
Showing 25 most recent of 284 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 12424517 | Monolithic conductive cylinder in a semiconductor device and associated methods | Wei Zhou, Kyle K. Kirby, Bret K. Street | 2025-09-23 |
| 12424590 | Semiconductor device assemblies and associated methods | Bharat Bhushan, Akshay N. Singh | 2025-09-23 |
| 12424516 | Monolithic conductive column in a semiconductor device and associated methods | Wei Zhou, Kyle K. Kirby, Bret K. Street | 2025-09-23 |
| 12387780 | Testing memory of wafer-on-wafer bonded memory and logic | Glen E. Hush, Sean S. Eilert, Aliasger T. Zaidy | 2025-08-12 |
| 12381131 | Front end of line interconnect structures and associated systems and methods | Kyle K. Kirby | 2025-08-05 |
| 12368096 | Microelectronic devices with through-substrate interconnects and associated methods of manufacturing | Kyle K. Kirby, Sarah A. Niroumand | 2025-07-22 |
| 12362243 | Semiconductor device assemblies including TSVs of different lengths and methods of making the same | — | 2025-07-15 |
| 12363895 | Integrated assemblies and methods of forming integrated assemblies | Justin B. Dorhout, Martin C. Roberts, Mohd Kamran Akhtar, Chet E. Carter, David Daycock | 2025-07-15 |
| 12354649 | Signal routing between memory die and logic die for performing operations | Aliasger T. Zaidy, Sean S. Eilert, Glen E. Hush | 2025-07-08 |
| 12334448 | Front end of line interconnect structures and associated systems and methods | Kyle K. Kirby | 2025-06-17 |
| 12261111 | Memory devices and related methods of forming a memory device | — | 2025-03-25 |
| 12243610 | Memory with parallel main and test interfaces | James B. Johnson, Brent Keeth, Eiichi Nakano, Amy R. Griffin | 2025-03-04 |
| 12205846 | Methods of forming microelectronic devices, and related electronic systems | — | 2025-01-21 |
| 12205865 | Semiconductor device assemblies including monolithic silicon structures for thermal dissipation and methods of making the same | Angela S. Parekh | 2025-01-21 |
| 12199070 | 3D NAND memory device devices and related electronic systems | Paolo Tessariol, Akira Goda | 2025-01-14 |
| 12185537 | Integrated structures | Justin B. Dorhout, David Daycock, Martin C. Roberts, Yushi Hu | 2024-12-31 |
| 12183716 | Monolithic conductive columns in a semiconductor device and associated methods | Wei Zhou, Kyle K. Kirby, Bret K. Street | 2024-12-31 |
| 12165696 | Signal routing between memory die and logic die | Sean S. Eilert, Glen E. Hush, Aliasger T. Zaidy | 2024-12-10 |
| 12167602 | Integrated assemblies having thicker semiconductor material along one region of a conductive structure than along another region, and methods of forming integrated assemblies | — | 2024-12-10 |
| 12154893 | Base structures for microelectronic devices | — | 2024-11-26 |
| 12112792 | Memory device for wafer-on-wafer formed memory and logic | Glen E. Hush, Sean S. Eilert, Aliasger T. Zaidy | 2024-10-08 |
| 12112793 | Signal routing between memory die and logic die for mode based operations | Aliasger T. Zaidy, Glen E. Hush, Sean S. Eilert | 2024-10-08 |
| 12107050 | Front end of line interconnect structures and associated systems and methods | Kyle K. Kirby | 2024-10-01 |
| 12096626 | 3D NAND flash memory devices, and related electronic systems | — | 2024-09-17 |
| 12089422 | Microelectronic devices, and related methods and memory devices | — | 2024-09-10 |