| 12408341 |
Memory arrays, and methods of forming memory arrays |
Changhan Kim, Cole Smith, Collin Howder, Richard J. Hill, Jie Li |
2025-09-02 |
|
| 12363895 |
Integrated assemblies and methods of forming integrated assemblies |
Justin B. Dorhout, Kunal R. Parekh, Martin C. Roberts, Mohd Kamran Akhtar, David Daycock |
2025-07-15 |
|
| 12200929 |
Integrated circuitry comprising a memory array comprising strings of memory cells and method used in forming a memory array comprising strings of memory cells |
Collin Howder, M. Jared Barclay, Bhavesh Bhartia, John D. Hopkins, Andrew Li +3 more |
2025-01-14 |
|
| 12185545 |
Memory arrays and methods used in forming a memory array comprising strings of memory cells |
Collin Howder |
2024-12-31 |
|
| 12160993 |
Memory devices including different tier pitches, and related electronic systems |
Yifen Liu, Tecla Ghilardi, George Matamis, Justin D. Shepherdson, Nancy M. Lomeli +1 more |
2024-12-03 |
|
| 12137564 |
Methods of forming microelectronic devices |
Collin Howder, Justin D. Shepherdson |
2024-11-05 |
$88,145,000 |
| 12040253 |
Memory arrays comprising strings of memory cells and methods used in forming a memory array comprising strings of memory cells |
Alyssa N. Scarbrough, John D. Hopkins, Justin D. Shepherdson, Collin Howder, Joshua Wolanyk |
2024-07-16 |
$30,823,000 |
| 12029032 |
Integrated assemblies and methods of forming integrated assemblies |
Justin B. Dorhout, Kunal R. Parekh, Martin C. Roberts, Mohd Kamran Akhtar, David Daycock |
2024-07-02 |
$50,597,000 |
| 11937429 |
Integrated structures including material containing silicon, nitrogen, and at least one of carbon, oxygen, boron and phosphorus |
Justin B. Dorhout, Fei Wang, Ian C. Laboriante, John D. Hopkins, Kunal Shrotri +5 more |
2024-03-19 |
$27,819,000 |
| 11871566 |
Memory arrays comprising strings of memory cells and methods used in forming a memory array comprising strings of memory cells |
Collin Howder |
2024-01-09 |
|
| 11751396 |
Microelectronic devices including varying tier pitch, and related electronic systems |
Yifen Liu, Tecla Ghilardi, George Matamis, Justin D. Shepherdson, Nancy M. Lomeli +1 more |
2023-09-05 |
|
| 11737278 |
Memory arrays and methods used in forming a memory array comprising strings of memory cells |
Collin Howder |
2023-08-22 |
$9,108,000 |
| 11737275 |
Microelectronic devices including filled slits and memory cell pillars, and related memory devices and electronic systems |
Collin Howder, Justin D. Shepherdson |
2023-08-22 |
$9,108,000 |
| 11705385 |
Memory arrays and methods used in forming a memory array and conductive through-array-vias (TAVs) |
Indra V. Chary, Anilkumar Chandolu, Justin B. Dorhout, Jun Fang, Matthew J. King +3 more |
2023-07-18 |
$8,312,000 |
| 11631684 |
Integrated assemblies and methods of forming integrated assemblies |
Justin B. Dorhout, Kunal R. Parekh, Martin C. Roberts, Mohd Kamran Akhtar, David Daycock |
2023-04-18 |
$17,530,000 |
| 11411015 |
Memory arrays and methods used in forming a memory array |
Collin Howder |
2022-08-09 |
$10,590,000 |
| 11335694 |
Memory arrays and methods used in forming a memory array comprising strings of memory cells |
Collin Howder |
2022-05-17 |
$11,540,000 |
| 11302708 |
Memory arrays, and methods of forming memory arrays |
Changhan Kim, Cole Smith, Collin Howder, Richard J. Hill, Jie Li |
2022-04-12 |
$14,807,000 |
| 11276701 |
Memory arrays comprising strings of memory cells and methods used in forming a memory array comprising strings of memory cells |
Collin Howder |
2022-03-15 |
$16,938,000 |
| 11264404 |
Microelectronic devices including a varying tier pitch, and related electronic systems and methods |
Yifen Liu, Tecla Ghilardi, George Matamis, Justin D. Shepherdson, Nancy M. Lomeli +1 more |
2022-03-01 |
$21,169,000 |
| 11239252 |
Integrated structures including material containing silicon, nitrogen, and at least one of carbon, oxygen, boron and phosphorus |
Justin B. Dorhout, Fei Wang, Ian C. Laboriante, John D. Hopkins, Kunal Shrotri +5 more |
2022-02-01 |
$13,825,000 |
| 11069598 |
Memory arrays and methods used in forming a memory array and conductive through-array-vias (TAVs) |
Indra V. Chary, Anilkumar Chandolu, Justin B. Dorhout, Jun Fang, Matthew J. King +3 more |
2021-07-20 |
$22,424,000 |
| 10998326 |
Integrated assemblies and methods of forming integrated assemblies |
Justin B. Dorhout, Kunal R. Parekh, Martin C. Roberts, Mohd Kamran Akhtar, David Daycock |
2021-05-04 |
$18,454,000 |
| 10943921 |
Methods of forming integrated assemblies |
Jordan D. Greenlee, Collin Howder, John Mark Meldrim, Everett A. McTeer |
2021-03-09 |
$21,153,000 |
| 10930658 |
Memory arrays and methods used in forming a memory array |
Collin Howder |
2021-02-23 |
$23,020,000 |
