| 12432984 |
Microelectronic devices including stack structures having doped interfacial regions, and related systems and methods |
Everett A. McTeer, Farrell M. Good, Jordan D. Greenlee, Justin D. Shepherdson, Naiming Liu +1 more |
2025-09-30 |
|
| 12324157 |
Integrated circuitry, comprising a pair of opposing lateral projections in insulating material in a cavity |
Jivaan Kishore Jhothiraman |
2025-06-03 |
|
| 12295140 |
Memory arrays comprising strings of memory cells and methods used in forming a memory array comprising strings of memory cells |
Jordan D. Greenlee, Allen McTeer, Rita J. Klein, John D. Hopkins, Nancy M. Lomeli +7 more |
2025-05-06 |
|
| 12218081 |
Microelectronic devices with a polysilicon structure above a staircase structure, and related methods |
Jivaan Kishore Jhothiraman, Lifang Xu |
2025-02-04 |
|
| 12114492 |
Memories having vertically stacked conductive filled structures |
Jordan D. Greenlee, Everett A. McTeer |
2024-10-08 |
$26,633,000 |
| 12034057 |
Assemblies which include wordlines having a first metal-containing material at least partially surrounding a second metal-containing material and having different crystallinity than the second metal-containing material |
Jordan D. Greenlee, Rita J. Klein, Everett A. McTeer |
2024-07-09 |
$66,342,000 |
| 11990528 |
Assemblies having conductive structures with three or more different materials |
David Ross Economy, Rita J. Klein, Jordan D. Greenlee, Brenda D. Kraus, Everett A. McTeer |
2024-05-21 |
|
| 11818968 |
Conductive interconnects suitable for utilization in integrated assemblies, and methods of forming conductive interconnects |
Jordan D. Greenlee, Tao Nguyen, Aaron K. Belsher |
2023-11-14 |
$19,045,000 |
| 11710710 |
Microelectronic devices with a polysilicon structure adjacent a staircase structure, and related methods |
Jivaan Kishore Jhothiraman, Lifang Xu |
2023-07-25 |
|
| 11705500 |
Assemblies having conductive structures with three or more different materials |
David Ross Economy, Rita J. Klein, Jordan D. Greenlee, Brenda D. Kraus, Everett A. McTeer |
2023-07-18 |
$8,312,000 |
| 11646206 |
Methods of forming tungsten structures |
David Ross Economy, Brian Beatty, Yongjun Jeff Hu, Jordan D. Greenlee |
2023-05-09 |
$19,484,000 |
| 11647633 |
Methods used in forming integrated circuitry comprising a stack comprising vertically-alternating first tiers and second tiers with the stack comprising a cavity therein that comprises a stair-step structure |
Jivaan Kishore Jhothiraman |
2023-05-09 |
$19,484,000 |
| 11177276 |
Conductive structures, assemblies having vertically-stacked memory cells over conductive structures, and methods of forming conductive structures |
Nancy M. Lomeli, Tom George, Jordan D. Greenlee, Scott M. Pook |
2021-11-16 |
$19,987,000 |
| 11158718 |
Assemblies which include wordlines having a first metal-containing material at least partially surrounding a second metal-containing material and having different crystallinity than the second metal-containing material |
Jordan D. Greenlee, Rita J. Klein, Everett A. McTeer |
2021-10-26 |
$16,064,000 |
| 11127899 |
Conductive interconnects suitable for utilization in integrated assemblies, and methods of forming conductive interconnects |
Jordan D. Greenlee, Tao Nguyen, Aaron K. Belsher |
2021-09-21 |
$21,559,000 |
| 11088088 |
Microelectronic devices with polysilicon fill material between opposing staircase structures, and related devices, systems, and methods |
Jivaan Kishore Jhothiraman, Lifang Xu |
2021-08-10 |
$13,320,000 |
| 11081644 |
Apparatuses including electrodes having a conductive barrier material and methods of forming same |
Swapnil Lengade, Andrea Gotti |
2021-08-03 |
$20,873,000 |
| 11031417 |
Methods used in forming an array of elevationally-extending transistors |
Jordan D. Greenlee, E. Allen McTeer |
2021-06-08 |
$24,475,000 |
| 10998481 |
Ohmic contacts for semiconductor structures |
Yongjun Jeff Hu, Shanming Mou, Everett A. McTeer |
2021-05-04 |
$18,454,000 |
| 10957855 |
Apparatuses including electrodes having a conductive barrier material and methods of forming same |
Swapnil Lengade, Andrea Gotti |
2021-03-23 |
$19,320,000 |
| 10957775 |
Assemblies having conductive structures with three or more different materials |
David Ross Economy, Rita J. Klein, Jordan D. Greenlee, Brenda D. Kraus, Everett A. McTeer |
2021-03-23 |
$19,320,000 |
| 10950791 |
Apparatuses including electrodes having a conductive barrier material and methods of forming same |
Swapnil Lengade, Andrea Gotti |
2021-03-16 |
$22,312,000 |
| 10943921 |
Methods of forming integrated assemblies |
Jordan D. Greenlee, Chet E. Carter, Collin Howder, Everett A. McTeer |
2021-03-09 |
$21,153,000 |
| 10943920 |
Methods of fabricating integrated structures |
Yushi Hu, Rita J. Klein, John D. Hopkins, Hongbin Zhu, Gordon A. Haller +1 more |
2021-03-09 |
$21,153,000 |
| 10916564 |
Assemblies having vertically-extending structures, and methods of forming assemblies having vertically-extending channel material pillars |
David Ross Economy, Haoyu Li, Yongjun Jeff Hu, Christopher W. Petz, Daniel Billingsley +1 more |
2021-02-09 |
$22,943,000 |
