Issued Patents All Time
Showing 25 most recent of 66 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 12432984 | Microelectronic devices including stack structures having doped interfacial regions, and related systems and methods | Everett A. McTeer, Farrell M. Good, Jordan D. Greenlee, Justin D. Shepherdson, Naiming Liu +1 more | 2025-09-30 |
| 12324157 | Integrated circuitry, comprising a pair of opposing lateral projections in insulating material in a cavity | Jivaan Kishore Jhothiraman | 2025-06-03 |
| 12295140 | Memory arrays comprising strings of memory cells and methods used in forming a memory array comprising strings of memory cells | Jordan D. Greenlee, Allen McTeer, Rita J. Klein, John D. Hopkins, Nancy M. Lomeli +7 more | 2025-05-06 |
| 12218081 | Microelectronic devices with a polysilicon structure above a staircase structure, and related methods | Jivaan Kishore Jhothiraman, Lifang Xu | 2025-02-04 |
| 12114492 | Memories having vertically stacked conductive filled structures | Jordan D. Greenlee, Everett A. McTeer | 2024-10-08 |
| 12034057 | Assemblies which include wordlines having a first metal-containing material at least partially surrounding a second metal-containing material and having different crystallinity than the second metal-containing material | Jordan D. Greenlee, Rita J. Klein, Everett A. McTeer | 2024-07-09 |
| 11990528 | Assemblies having conductive structures with three or more different materials | David Ross Economy, Rita J. Klein, Jordan D. Greenlee, Brenda D. Kraus, Everett A. McTeer | 2024-05-21 |
| 11818968 | Conductive interconnects suitable for utilization in integrated assemblies, and methods of forming conductive interconnects | Jordan D. Greenlee, Tao Nguyen, Aaron K. Belsher | 2023-11-14 |
| 11710710 | Microelectronic devices with a polysilicon structure adjacent a staircase structure, and related methods | Jivaan Kishore Jhothiraman, Lifang Xu | 2023-07-25 |
| 11705500 | Assemblies having conductive structures with three or more different materials | David Ross Economy, Rita J. Klein, Jordan D. Greenlee, Brenda D. Kraus, Everett A. McTeer | 2023-07-18 |
| 11647633 | Methods used in forming integrated circuitry comprising a stack comprising vertically-alternating first tiers and second tiers with the stack comprising a cavity therein that comprises a stair-step structure | Jivaan Kishore Jhothiraman | 2023-05-09 |
| 11646206 | Methods of forming tungsten structures | David Ross Economy, Brian Beatty, Yongjun Jeff Hu, Jordan D. Greenlee | 2023-05-09 |
| 11177276 | Conductive structures, assemblies having vertically-stacked memory cells over conductive structures, and methods of forming conductive structures | Nancy M. Lomeli, Tom George, Jordan D. Greenlee, Scott M. Pook | 2021-11-16 |
| 11158718 | Assemblies which include wordlines having a first metal-containing material at least partially surrounding a second metal-containing material and having different crystallinity than the second metal-containing material | Jordan D. Greenlee, Rita J. Klein, Everett A. McTeer | 2021-10-26 |
| 11127899 | Conductive interconnects suitable for utilization in integrated assemblies, and methods of forming conductive interconnects | Jordan D. Greenlee, Tao Nguyen, Aaron K. Belsher | 2021-09-21 |
| 11088088 | Microelectronic devices with polysilicon fill material between opposing staircase structures, and related devices, systems, and methods | Jivaan Kishore Jhothiraman, Lifang Xu | 2021-08-10 |
| 11081644 | Apparatuses including electrodes having a conductive barrier material and methods of forming same | Swapnil Lengade, Andrea Gotti | 2021-08-03 |
| 11031417 | Methods used in forming an array of elevationally-extending transistors | Jordan D. Greenlee, E. Allen McTeer | 2021-06-08 |
| 10998481 | Ohmic contacts for semiconductor structures | Yongjun Jeff Hu, Shanming Mou, Everett A. McTeer | 2021-05-04 |
| 10957775 | Assemblies having conductive structures with three or more different materials | David Ross Economy, Rita J. Klein, Jordan D. Greenlee, Brenda D. Kraus, Everett A. McTeer | 2021-03-23 |
| 10957855 | Apparatuses including electrodes having a conductive barrier material and methods of forming same | Swapnil Lengade, Andrea Gotti | 2021-03-23 |
| 10950791 | Apparatuses including electrodes having a conductive barrier material and methods of forming same | Swapnil Lengade, Andrea Gotti | 2021-03-16 |
| 10943921 | Methods of forming integrated assemblies | Jordan D. Greenlee, Chet E. Carter, Collin Howder, Everett A. McTeer | 2021-03-09 |
| 10943920 | Methods of fabricating integrated structures | Yushi Hu, Rita J. Klein, John D. Hopkins, Hongbin Zhu, Gordon A. Haller +1 more | 2021-03-09 |
| 10916564 | Assemblies having vertically-extending structures, and methods of forming assemblies having vertically-extending channel material pillars | David Ross Economy, Haoyu Li, Yongjun Jeff Hu, Christopher W. Petz, Daniel Billingsley +1 more | 2021-02-09 |