Issued Patents All Time
Showing 1–24 of 24 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 12431407 | Memory device with low density thermal barrier | Pengyuan Zheng, Yongjun Jeff Hu, Kent H. Zhuang, Robert K. Grubbs | 2025-09-30 |
| 12322443 | Memory arrays comprising strings of memory cells and methods used in forming a memory array comprising strings of memory cells | Jordan D. Greenlee, John D. Hopkins, Nancy M. Lomeli, Jiewei Chen, Rita J. Klein +2 more | 2025-06-03 |
| 12087358 | Access line grain modulation in a memory device | Stephen W. Russell | 2024-09-10 |
| 12022666 | Memory cell stack and via formation for a memory device | Andrew Leslie Beemer | 2024-06-25 |
| 11990528 | Assemblies having conductive structures with three or more different materials | Rita J. Klein, Jordan D. Greenlee, John Mark Meldrim, Brenda D. Kraus, Everett A. McTeer | 2024-05-21 |
| 11984382 | Memory device with low density thermal barrier | Pengyuan Zheng, Yongjun Jeff Hu, Kent H. Zhuang, Robert K. Grubbs | 2024-05-14 |
| 11721606 | Memory device with high resistivity thermal barrier | Pengyuan Zheng | 2023-08-08 |
| 11705500 | Assemblies having conductive structures with three or more different materials | Rita J. Klein, Jordan D. Greenlee, John Mark Meldrim, Brenda D. Kraus, Everett A. McTeer | 2023-07-18 |
| 11646206 | Methods of forming tungsten structures | Brian Beatty, John Mark Meldrim, Yongjun Jeff Hu, Jordan D. Greenlee | 2023-05-09 |
| 11456208 | Methods of forming apparatuses including air gaps between conductive lines and related apparatuses, memory devices, and electronic systems | Sidhartha Gupta, Richard J. Hill, Kyle A. Ritter, Naveen Kaushik | 2022-09-27 |
| 11349068 | Memory cells | Pengyuan Zheng, Stephen W. Russell | 2022-05-31 |
| 11189662 | Memory cell stack and via formation for a memory device | Andrew Leslie Beemer | 2021-11-30 |
| 11158561 | Memory device with low density thermal barrier | Pengyuan Zheng, Yongjun Jeff Hu, Kent H. Zhuang, Robert K. Grubbs | 2021-10-26 |
| 11018298 | Phase change memory structures | Christopher W. Petz | 2021-05-25 |
| 10991425 | Access line grain modulation in a memory device | Stephen W. Russell | 2021-04-27 |
| 10964621 | Memory device with high resistivity thermal barrier | Pengyuan Zheng | 2021-03-30 |
| 10957775 | Assemblies having conductive structures with three or more different materials | Rita J. Klein, Jordan D. Greenlee, John Mark Meldrim, Brenda D. Kraus, Everett A. McTeer | 2021-03-23 |
| 10916564 | Assemblies having vertically-extending structures, and methods of forming assemblies having vertically-extending channel material pillars | John Mark Meldrim, Haoyu Li, Yongjun Jeff Hu, Christopher W. Petz, Daniel Billingsley +1 more | 2021-02-09 |
| 10847367 | Methods of forming tungsten structures | Brian Beatty, John Mark Meldrim, Yongjun Jeff Hu, Jordan D. Greenlee | 2020-11-24 |
| 10700091 | Assemblies having vertically-extending structures, and methods of forming assemblies having vertically-extending channel material pillars | John Mark Meldrim, Haoyu Li, Yongjun Jeff Hu, Christopher W. Petz, Daniel Billingsley +1 more | 2020-06-30 |
| 10475810 | Conductive components and memory assemblies | Sudip Bandyopadhyay, Keen Wah Chow, Devesh Kumar Datta, Anurag Jindal, John Mark Meldrim | 2019-11-12 |
| 10355014 | Assemblies having vertically-extending structures | John Mark Meldrim, Haoyu Li, Yongjun Jeff Hu, Christopher W. Petz, Daniel Billingsley +1 more | 2019-07-16 |
| 10014319 | Conductive components and memory assemblies | Sudip Bandyopadhyay, Keen Wah Chow, Devesh Kumar Datta, Anurag Jindal, John Mark Meldrim | 2018-07-03 |
| 9773807 | Conductive components and memory assemblies | Sudip Bandyopadhyay, Keen Wah Chow, Devesh Kumar Datta, Anurag Jindal, John Mark Meldrim | 2017-09-26 |