Issued Patents All Time
Showing 1–14 of 14 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 12389599 | Integrated assemblies and methods of forming integrated assemblies | Sidhartha Gupta, Pankaj Sharma, Kyle A. Ritter | 2025-08-12 |
| 12356617 | Microelectronic devices with vertically recessed channel structures and discrete, spaced inter-slit structures, and related methods and systems | Haitao Liu, Litao Yang, Albert Fayrushin, Jian Li, Collin Howder | 2025-07-08 |
| 12237259 | Electronic devices comprising multilevel bitlines, and related methods and systems | Yoshiaki Fukuzumi, Harsh Narendrakumar Jain, Adam L. Olson, Richard J. Hill, Lars Heineck | 2025-02-25 |
| 12154853 | Apparatuses including device structures including pillar structures | Sidhartha Gupta, Pankaj Sharma, Haitao Liu | 2024-11-26 |
| 12137553 | Memory array and method used in forming a memory array | Sidhartha Gupta, Pankaj Sharma | 2024-11-05 |
| 12080756 | Altering breakdown voltages in gate devices and related methods and systems | Gaurav Musalgaonkar, Sonam Jain, Haitao Liu, Chittoor Parthasarathy | 2024-09-03 |
| 12068240 | Capacitor in a three-dimensional memory structure | Xiaojiang Guo, Shuai Xu, June Lee | 2024-08-20 |
| 11728263 | Integrated assemblies having conductive-shield-structures between linear-conductive-structures | Yoshihiko Kamata, Richard J. Hill, Kyle A. Ritter, Tomoko Ogura Iwasaki, Haitao Liu | 2023-08-15 |
| 11605588 | Memory device including data lines on multiple device levels | Violante Moschiano, Paolo Tessariol, Aaron Yip | 2023-03-14 |
| 11605589 | Methods of forming microelectronic devices, and related microelectronic devices, memory devices, and electronic systems | Sidhartha Gupta, Pankaj Sharma, Haitao Liu | 2023-03-14 |
| 11515311 | Semiconductor structure formation at differential depths | Venkata Naveen Kumar Neelapala, Deepak Chandra Pandey | 2022-11-29 |
| 11456208 | Methods of forming apparatuses including air gaps between conductive lines and related apparatuses, memory devices, and electronic systems | Sidhartha Gupta, David Ross Economy, Richard J. Hill, Kyle A. Ritter | 2022-09-27 |
| 11302628 | Integrated assemblies having conductive-shield-structures between linear-conductive-structures | Yoshihiko Kamata, Richard J. Hill, Kyle A. Ritter, Tomoko Ogura Iwasaki, Haitao Liu | 2022-04-12 |
| 11195560 | Integrated assemblies having void regions between digit lines and conductive structures, and methods of forming integrated assemblies | Fatma Arzum Simsek-Ege, Deepak Chandra Pandey | 2021-12-07 |