Patent Leaderboard
USPTO Patent Rankings Data through Dec 31, 2025
Home › Conductive interconnects suitable for utilization in integrated assemblies, and methods of forming conductive interconnects

Conductive interconnects suitable for utilization in integrated assemblies, and methods of forming conductive interconnects

US Patent 11127899 · Granted Sep 21, 2021

Estimated economic value: $21,559,000 ⓘ

Assignee

Inventors

View full patent text on Google Patents →

More Patents by These Inventors

Integrated assemblies and methods of forming integrated assemblies2025
Memory circuitry and method used in forming memory circuitry2025
Memory arrays comprising strings of memory cells and methods used in forming a m2025
Methods used in forming a memory array comprising strings of memory cells and me2025
Methods used in forming memory arrays having strings of memory cells2025
Metal-containing structures, and methods of treating metal-containing material t2025
Conductive interconnects and methods of forming conductive interconnects2025
Memory arrays comprising strings of memory cells and methods used in forming a m2025
Microelectronic devices comprising a boron-containing material, and related elec2025
Memory arrays comprising strings of memory cells and methods used in forming a m2025
Self-aligned memory architecture comprising a memory array associated with pilla2025
Microelectronic devices including stack structures having doped interfacial regi2025