Issued Patents All Time
Showing 1–25 of 25 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 8357933 | Manufacturing method of semiconductor integrated circuit device | Akio Hasebe, Hideyuki Matsumoto, Shingo Yorisaki, Yasuhiro Motoyama, Masayoshi Okamoto +1 more | 2013-01-22 |
| 8206997 | Method of manufacturing a semiconductor integrated circuit device and a method of manufacturing a thin film probe sheet for using the same | Akio Hasebe, Yasuhiro Motoyama, Seigo Nakamura, Kenji Kawakami | 2012-06-26 |
| 8062911 | Method of manufacturing a semiconductor integrated circuit device and a method of manufacturing a thin film probe sheet for using the same | Akio Hasebe, Yasuhiro Motoyama, Seigo Nakamura, Kenji Kawakami | 2011-11-22 |
| 7901958 | Fabrication method of semiconductor integrated circuit device | Masayoshi Okamoto, Yoshiaki Hasegawa, Yasuhiro Motoyama, Hideyuki Matsumoto, Shingo Yorisaki +4 more | 2011-03-08 |
| 7776626 | Manufacturing method of semiconductor integrated circuit device | Akio Hasebe, Hideyuki Matsumoto, Shingo Yorisaki, Yasuhiro Motoyama, Masayoshi Okamoto +1 more | 2010-08-17 |
| 7724006 | Probe card, manufacturing method of probe card, semiconductor inspection apparatus and manufacturing method of semiconductor device | Susumu Kasukabe | 2010-05-25 |
| 7656174 | Probe cassette, semiconductor inspection apparatus and manufacturing method of semiconductor device | Susumu Kasukabe | 2010-02-02 |
| 7598100 | Manufacturing method of semiconductor integrated circuit device | Hideyuki Matsumoto, Shingo Yorisaki, Akio Hasebe, Yasuhiro Motoyama, Masayoshi Okamoto | 2009-10-06 |
| 7537943 | Method of manufacturing a semiconductor integrated circuit device | Akio Hasebe, Yasuhiro Motoyama, Seigo Nakamura | 2009-05-26 |
| 7534629 | Manufacturing method of semiconductor integrated circuit device | Teruo Shoji, Akio Hasebe, Yoshinori Deguchi, Motoji Murakami, Masayoshi Okamoto +1 more | 2009-05-19 |
| 7423439 | Probe sheet adhesion holder, probe card, semiconductor test device, and manufacturing method of semiconductor device | Susumu Kasukabe, Teruo Shoji, Akio Hasebe, Yoshinori Deguchi | 2008-09-09 |
| 7407823 | Manufacturing method of semiconductor integrated circuit device | Akio Hasebe, Masayoshi Okamoto, Shingo Yorisaki, Yasuhiro Motoyama | 2008-08-05 |
| 7351597 | Fabrication method of semiconductor integrated circuit device | Yuji Wada, Susumu Kasukabe, Takehiko Hasebe, Akira Yabushita, Terutaka Mori +4 more | 2008-04-01 |
| 7235413 | Fabrication method of semiconductor integrated circuit device | Akio Hasebe, Yasuhiro Motoyama, Teruo Shoji | 2007-06-26 |
| 7219422 | Fabrication method of semiconductor integrated circuit device | Yuji Wada, Susumu Kasukabe, Takehiko Hasebe, Akira Yabushita, Terutaka Mori +4 more | 2007-05-22 |
| 7049837 | Probe sheet, probe card, semiconductor test equipment and semiconductor device fabrication method | Susumu Kasukabe, Takehiko Hasebe, Akio Hasebe | 2006-05-23 |
| 6707682 | Low-EMI electronic apparatus, low-EMI circuit board, and method of manufacturing the low-EMI circuit board | Yutaka Akiba, Hirayoshi Tanei, Naoya Kitamura | 2004-03-16 |
| 6353540 | Low-EMI electronic apparatus, low-EMI circuit board, and method of manufacturing the low-EMI circuit board. | Yutaka Akiba, Hirayoshi Tanei, Naoya Kitamura | 2002-03-05 |
| 6124553 | Multilayer wiring board having vent holes and method of making | Naoki Matsushima, Hidetaka Shigi, Haruhiko Matsuyama | 2000-09-26 |
| 5958600 | Circuit board and method of manufacturing the same | Hideo Sotokawa, Akira Yabushita, Takashi Inoue, Hidetaka Shigi, Mamoru Ogihara +2 more | 1999-09-28 |
| 5320729 | Sputtering target | Masakazu Ishino, Akihiro Kenmotsu, Yoshitaka Chiba, Akitoshi Hiraki | 1994-06-14 |
| 5285016 | Wiring board provided with a heat bypass layer | Akihiro Kemmotsu, Masakazu Ishino, Eiji Matsuzaki | 1994-02-08 |
| 5235313 | Thin film resistor and wiring board using the same | Syoozi Ikeda, Akira Yabushita, Masakazu Ishino, Juichi Kishida | 1993-08-10 |
| 5218335 | Electronic circuit device having thin film resistor and method for producing the same | Asao Nakano, Kiyoshi Ogata, Makiko Kohno | 1993-06-08 |
| 4806725 | Circuit substrate and thermal printing head using the same | Keiji Mori, Akira Yabushita, Tsuneaki Kamei, Mamoru Morita | 1989-02-21 |