Issued Patents All Time
Showing 1–13 of 13 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 11834451 | Compositions and methods for inhibiting virus protein 2C activity and for preventing and treating non-polio enterovirus infection | Jun Wang | 2023-12-05 |
| 11628153 | Agent for preventing or amelioriting nocturia | — | 2023-04-18 |
| 10550246 | Rubber composition for tire, and pneumatic tire | Ryuichi Tokimune | 2020-02-04 |
| 10550247 | Rubber composition for tires, and pneumatic tire | Ryuichi Tokimune, Kouji Kawaguchi, Naoya Hashimoto | 2020-02-04 |
| 10377178 | Rubber composition for tires, and pneumatic tire | Ryuichi Tokimune, Kouji Kawaguchi, Naoya Hashimoto | 2019-08-13 |
| 6707682 | Low-EMI electronic apparatus, low-EMI circuit board, and method of manufacturing the low-EMI circuit board | Yutaka Akiba, Yasunori Narizuka, Hirayoshi Tanei | 2004-03-16 |
| 6506982 | Multi-layer wiring substrate and manufacturing method thereof | Hidetaka Shigi, Masashi Nishiki, Tetsuya Yamazaki, Takehiko Hasebe, Masayuki Kyooi +1 more | 2003-01-14 |
| 6404205 | Method for testing the reliability of an electrochemical gas sensor | — | 2002-06-11 |
| 6353540 | Low-EMI electronic apparatus, low-EMI circuit board, and method of manufacturing the low-EMI circuit board. | Yutaka Akiba, Yasunori Narizuka, Hirayoshi Tanei | 2002-03-05 |
| 5480048 | Multilayer wiring board fabricating method | Hisashi Sugiyama, Yoshihide Yamaguchi, Masayuki Kyoui, Hideyasu Murooka, Ryoji Iwamura +1 more | 1996-01-02 |
| 5393406 | Method of producing a thin film multilayer wiring board | Hitoshi Yokono, Hideo Arima, Takashi Inoue | 1995-02-28 |
| 5388328 | Process for fabricating an interconnected multilayer board | Hitoshi Yokono, Hideo Arima, Takashi Inoue, Haruhiko Matsuyama, Hitoshi Oka +4 more | 1995-02-14 |
| 5300735 | Interconnected multilayer boards and fabrication processes thereof | Hitoshi Yokono, Hideo Arima, Takashi Inoue, Haruhiko Matsuyama, Hitoshi Oka +4 more | 1994-04-05 |