Issued Patents All Time
Showing 1–18 of 18 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 7541202 | Connection device and test system | Susumu Kasukabe, Terutaka Mori, Akihiko Ariga, Takayoshi Watanabe, Ryuji Kono | 2009-06-02 |
| 7390732 | Method for producing a semiconductor device with pyramidal bump electrodes bonded onto pad electrodes arranged on a semiconductor chip | Takayoshi Watanabe, Susumu Kasukabe, Terutaka Mori | 2008-06-24 |
| 7285430 | Connection device and test system | Susumu Kasukabe, Terutaka Mori, Akihiko Ariga, Takayoshi Watanabe, Ryuji Kono | 2007-10-23 |
| 7198962 | Semiconductor device and manufacturing method thereof including a probe test step and a burn-in test step | Ryuji Kohno, Tetsuo Kumazawa, Makoto Kitano, Akihiko Ariga, Yuji Wada +7 more | 2007-04-03 |
| 6759258 | Connection device and test system | Susumu Kasukabe, Terutaka Mori, Akihiko Ariga, Takayoshi Watanabe, Ryuji Kono | 2004-07-06 |
| 6566150 | Semiconductor device and manufacturing method thereof including a probe test step and a burn-in test step | Ryuji Kohno, Tetsuo Kumazawa, Makoto Kitano, Akihiko Ariga, Yuji Wada +7 more | 2003-05-20 |
| 6506982 | Multi-layer wiring substrate and manufacturing method thereof | Naoya Kitamura, Masashi Nishiki, Tetsuya Yamazaki, Takehiko Hasebe, Masayuki Kyooi +1 more | 2003-01-14 |
| 6455335 | Semiconductor device and manufacturing method thereof including a probe test step and a burn-in test step | Ryuji Kohno, Tetsuo Kumazawa, Makoto Kitano, Akihiko Ariga, Yuji Wada +7 more | 2002-09-24 |
| 6305230 | Connector and probing system | Susumu Kasukabe, Terutaka Mori, Akihiko Ariga, Takayoshi Watanabe, Ryuji Kono | 2001-10-23 |
| 6197603 | Semiconductor device and manufacturing method thereof including a probe test step and a burn-in test step | Ryuji Kohno, Tetsuo Kumazawa, Makoto Kitano, Akihiko Ariga, Yuji Wada +7 more | 2001-03-06 |
| 6124553 | Multilayer wiring board having vent holes and method of making | Yasunori Narizuka, Naoki Matsushima, Haruhiko Matsuyama | 2000-09-26 |
| 5958600 | Circuit board and method of manufacturing the same | Hideo Sotokawa, Akira Yabushita, Takashi Inoue, Mamoru Ogihara, Haruhiko Matsuyama +2 more | 1999-09-28 |
| 5868949 | Metalization structure and manufacturing method thereof | Hideo Sotokawa, Masashi Nishiki, Eiji Matsuzaki, Toshio Terouchi, Mamoru Ogihara +2 more | 1999-02-09 |
| 5753372 | Wiring structures and method of manufacturing the same | Hideo Sotokawa, Miharu Otani, Fumio Kataoka, Fusaji Shoji, Haruhiko Matsuyama +5 more | 1998-05-19 |
| 5262614 | Circuit board and sealing structure and methods for manufacturing the same | Kaoru Katayama | 1993-11-16 |
| 5208656 | Multilayer wiring substrate and production thereof | Haruhiko Matsuyama, Mitsuo Yoshimoto, Jun Tanaka, Fusaji Shoji, Hitoshi Yokono +3 more | 1993-05-04 |
| 5162240 | Method and apparatus of fabricating electric circuit pattern on thick and thin film hybrid multilayer wiring substrate | Norio Saitou, Hideo Todokoro, Katsuhiro Kuroda, Satoru Fukuhara, Genya Matsuoka +3 more | 1992-11-10 |
| 4930002 | Multi-chip module structure | Takaji Takenaka, Tositada Netsu, Masakazu Yamamoto | 1990-05-29 |