Issued Patents All Time
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 5926375 | Surface mounting structure | Hideki Watanabe, Tsutomu Imai, Takeshi Yamaguchi, Kenichi Kasai, Fumio Imahashi +2 more | 1999-07-20 |
| 5844311 | Multichip module with heat sink and attachment means | Hideki Watanabe, Kenichi Kasai, Hiroyuki Hidaka, Osamu Yamada, Mitsunori Tamura | 1998-12-01 |
| 5276289 | Electronic circuit device and method of producing the same | Ryohei Satoh, Fumiyuki Kobayashi, Yutaka Watanabe, Mitugu Shirai, Kenji Takeda +3 more | 1994-01-04 |
| 4930002 | Multi-chip module structure | Takaji Takenaka, Hidetaka Shigi, Masakazu Yamamoto | 1990-05-29 |
| 4875618 | Wire stacked bonding method | Hiroshi Hasegawa, Koichi Sugimoto, Takeshi Yano, Mitsukiyo Tani, Tosaku Kojima | 1989-10-24 |