Issued Patents All Time
Showing 1–10 of 10 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 6272020 | Structure for mounting a semiconductor device and a capacitor device on a substrate | Hiromi Tosaki, Kazutoshi Takahashi, Norio Sengoku, Toshitada Netsu | 2001-08-07 |
| 5291419 | Method for diagnosing the life of a solder connection | Ryohei Satoh, Katsuhiro Arakawa, Kiyoshi Kanai, Tsutomu Takahashi, Haruhiko Imada | 1994-03-01 |
| 5257452 | Methods of recovering a multi-layer printed circuit board | Tsutomu Imai, Takashi Itoh | 1993-11-02 |
| 5249100 | Electronic circuit device provided with a ceramic substrate having lead pins bonded thereto by solder | Ryohei Satoh, Kazuo Hirota, Hideki Watanabe, Toshinori Ameya, Toshihiko Ohta | 1993-09-28 |
| 5136360 | Electronic circuit device, method of connecting with solder and solder for connecting gold-plated terminals | Masahide Harada, Ryohei Satoh, Fumiyuki Kobayashi, Toshitada Netsu, Hideaki Sasaki +1 more | 1992-08-04 |
| 4930002 | Multi-chip module structure | Tositada Netsu, Hidetaka Shigi, Masakazu Yamamoto | 1990-05-29 |
| 4836434 | Method and apparatus for airtightly packaging semiconductor package | Hideki Watanabe, Fumiyuki Kobayashi | 1989-06-06 |
| 4725925 | Circuit board | Minoru Tanaka, Kazuo Hirota, Akira Murata, Fumiuki Kobayashi | 1988-02-16 |
| 4706165 | Multilayer circuit board | Hideki Watanabe, Haruhiko Imada | 1987-11-10 |
| 4619316 | Heat transfer apparatus | Wataru Nakayama, Tadakatsu Nakajima, Shigeki Hirasawa, Akiomi Kohno | 1986-10-28 |