AK

Akiomi Kohno

HI Hitachi: 17 patents #2,231 of 28,497Top 8%
HE Hitachi Vlsi Engineering: 2 patents #292 of 666Top 45%
Overall (All Time): #280,496 of 4,157,543Top 7%
17
Patents All Time

Issued Patents All Time

Showing 1–17 of 17 patents

Patent #TitleCo-InventorsDate
5964398 Vane member and method for producing joint Kazuaki Yokoi, Keiji Taguchi, Hiroshi Misumi, Yoshiharu Ueyama, Kazuyuki Koide +1 more 1999-10-12
5400659 Electromagnetic flowmeter and manufacture method of same Kazuaki Yokoi, Masatsugu Arai, Yuji Yoshitomi, Yutaka Sakurai, Tamio Ishihara 1995-03-28
5358032 LSI package cooling heat sink, method of manufacturing the same and LSI package to which the heat sink is mounted Masatsugu Arai, Toshio Hatada, Yoshihiro Kondo, Toshihiro Komatsu, Kanji Otsuka +2 more 1994-10-25
5307687 Electromagnetic flowmeter Masatsugu Arai, Kazuaki Yokoi, Yuuji Yoshitomi, Yutaka Sakurai, Tamio Ishihara 1994-05-03
5276573 Slider unit controllably actuated at a surface of a moving information recording medium Takeshi Harada, Masatoshi Kanamaru, Atsushi Hosogane, Kenji Mori 1994-01-04
5233260 Stack-type piezoelectric element and process for production thereof Takeshi Harada, Shigeru Jomura 1993-08-03
5196756 Stack-type piezoelectric element, process for producing the same, and stack-type piezoelectric device Masatugu Arai, Takeshi Harada 1993-03-23
5188280 Method of bonding metals, and method and apparatus for producing semiconductor integrated circuit device using said method of bonding metals Takashi Nakao, Yoshiaki Emoto, Koichiro Sekiguchi, Masayuki Iketani, Kunizo Sahara +6 more 1993-02-23
5163209 Method of manufacturing a stack-type piezoelectric element Takeshi Harada, Masatoshi Kanamaru, Shigeru Jomura 1992-11-17
5090609 Method of bonding metals, and method and apparatus for producing semiconductor integrated circuit device using said method of bonding metals Takashi Nakao, Yoshiaki Emoto, Koichiro Sekiguchi, Masayuki Iketani, Kunizo Sahara +6 more 1992-02-25
4914950 Ceramic conduit assembly with metal outer tube Ikuo Uematsu, Masao Fukunaga 1990-04-10
4871107 Method for bonding ceramics to each other or a ceramic to a metal Toshihiro Yamada 1989-10-03
4854495 Sealing structure, method of soldering and process for preparing sealing structure Akihiko Yamamoto, Toshihiri Yamada, Motohiro Satou, Keiji Taguchi, Kazuaki Yokoi 1989-08-08
4749118 Method for bonding ceramic to metal Kazuaki Yokoi, Toshihiro Yamada, Motohiro Satou, Hiroyuki Kawamoto 1988-06-07
4699310 Method of bonding alumina to metal Hideo Nakae, Akihiko Yamamoto, Hiroyuki Kawamoto 1987-10-13
4624403 Method for bonding ceramics to metals Susumu Hioki, Toshihiro Yamada, Kazuaki Yokoi, Akihiko Yamamoto 1986-11-25
4619316 Heat transfer apparatus Wataru Nakayama, Tadakatsu Nakajima, Shigeki Hirasawa, Takaji Takenaka 1986-10-28