Issued Patents All Time
Showing 1–6 of 6 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 5309011 | Wafer scale or full wafer memory system, packaging method thereof, and wafer processing method employed therein | Masanori Tazunoki, Hiromitsu Mishimagi, Makoto Homma, Toshiyuki Sakuta, Hisashi Nakamura +8 more | 1994-05-03 |
| 5191224 | Wafer scale of full wafer memory system, packaging method thereof, and wafer processing method employed therein | Masanori Tazunoki, Hiromitsu Mishimagi, Makoto Homma, Toshiyuki Sakuta, Hisashi Nakamura +8 more | 1993-03-02 |
| 5188280 | Method of bonding metals, and method and apparatus for producing semiconductor integrated circuit device using said method of bonding metals | Takashi Nakao, Yoshiaki Emoto, Koichiro Sekiguchi, Masayuki Iketani, Ikuo Yoshida +6 more | 1993-02-23 |
| 5090609 | Method of bonding metals, and method and apparatus for producing semiconductor integrated circuit device using said method of bonding metals | Takashi Nakao, Yoshiaki Emoto, Koichiro Sekiguchi, Masayuki Iketani, Ikuo Yoshida +6 more | 1992-02-25 |
| 5067007 | Semiconductor device having leads for mounting to a surface of a printed circuit board | Kanji Otsuka, Masao Kato, Takashi Kumagai, Mitsuo Usami, Shigeo Kuroda +7 more | 1991-11-19 |
| 4764804 | Semiconductor device and process for producing the same | Kanji Otsuka, Hisashi Ishida | 1988-08-16 |