YE

Yoshiaki Emoto

SE Seiko Epson: 5 patents #2,973 of 7,774Top 40%
HI Hitachi: 4 patents #8,942 of 28,497Top 35%
HE Hitachi Vlsi Engineering: 2 patents #292 of 666Top 45%
NS Nippon Steel: 2 patents #1,308 of 4,423Top 30%
NS Nippon Steel Semiconductor: 1 patents #17 of 41Top 45%
📍 Higashiyamato, JP: #25 of 215 inventorsTop 15%
Overall (All Time): #426,876 of 4,157,543Top 15%
12
Patents All Time

Issued Patents All Time

Showing 1–12 of 12 patents

Patent #TitleCo-InventorsDate
6717250 Stacked semiconductor apparatus and electronic device including stacked semiconductor apparatus 2004-04-06
6664643 Semiconductor device and method for manufacturing the same 2003-12-16
6646335 Flexible tape carrier with external terminals formed on interposers 2003-11-11
6593648 Semiconductor device and method of making the same, circuit board and electronic equipment 2003-07-15
6441476 Flexible tape carrier with external terminals formed on interposers 2002-08-27
6118173 Lead frame and a semiconductor device 2000-09-12
5422163 Flexible substrate with projections to block resin flow Tadashi Kamiyama 1995-06-06
5362984 Semiconductor device with jumping wire Masashi Konda, Toshio Yamamoto 1994-11-08
5223454 Method of manufacturing semiconductor integrated circuit device Takayuki Uda, Tasuku Tanaka, Shigeo Kuroda 1993-06-29
5188280 Method of bonding metals, and method and apparatus for producing semiconductor integrated circuit device using said method of bonding metals Takashi Nakao, Koichiro Sekiguchi, Masayuki Iketani, Kunizo Sahara, Ikuo Yoshida +6 more 1993-02-23
5090609 Method of bonding metals, and method and apparatus for producing semiconductor integrated circuit device using said method of bonding metals Takashi Nakao, Koichiro Sekiguchi, Masayuki Iketani, Kunizo Sahara, Ikuo Yoshida +6 more 1992-02-25
5049972 Method of manufacturing semiconductor integrated circuit device Takayuki Uda, Tasuku Tanaka, Shigeo Kuroda 1991-09-17