Issued Patents All Time
Showing 1–7 of 7 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 5857610 | Process and apparatus for forming ball bumps | Hiroshi Hoshiba, Kohei Tatsumi, Yoji Kawakami | 1999-01-12 |
| 5803339 | Process and apparatus for forming ball bumps | Hiroshi Hoshiba, Kohei Tatsumi, Yoji Kawakami | 1998-09-08 |
| 5687901 | Process and apparatus for forming ball bumps | Hiroshi Hoshiba, Kohei Tatsumi, Yoji Kawakami | 1997-11-18 |
| 5362984 | Semiconductor device with jumping wire | Toshio Yamamoto, Yoshiaki Emoto | 1994-11-08 |
| 5150198 | Radiator for semiconductor chip | Naoharu Ohikata, Toshio Yamamoto | 1992-09-22 |
| 5137479 | Lead structure for packaging semiconductor chip | Naoharu Ohikata, Toshio Yamamoto, Tadashi Kamiyama | 1992-08-11 |
| 5114878 | Method of bonding bumps to leads of tab tape and an apparatus for arranging bumps used for the same | Tadakatsu Maruyama, Yasuhide Ohno, Tosiharu Kikuchi, Yasuhiro Suzuki, Tomohiro Uno +2 more | 1992-05-19 |