Issued Patents All Time
Showing 1–11 of 11 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 9825161 | Logical operation element | Yutaka Majima, Toshiharu Teranishi, Kazuhiko Matsumoto, Kenzo Maehashi, Tomofumi Susaki +2 more | 2017-11-21 |
| 9240561 | Nanodevice and method for fabricating the same | Yutaka Majima, Toshiharu Teranishi, Kazuhiko Matsumoto, Kenzo Maehashi, Yasuo Azuma +2 more | 2016-01-19 |
| 8318585 | Bonding method and bonding apparatus | Keisuke Taniguchi, Tatsuya Takeuchi, Taizo Hagihara | 2012-11-27 |
| 7964066 | Method for controlling structure of nano-scale substance, and method for preparing low dimensional quantum structure having nano-scale using the method for controlling structure | Kenzo Maehashi, Koichi Inoue, Kazuhiko Matsumoto | 2011-06-21 |
| 5761779 | Method of producing fine metal spheres of uniform size | Tadakatsu Maruyama, Osamu Kitamura, Tosiharu Kikuchi, Yasuhiro Suzuki, Hisao Kuribayashi +1 more | 1998-06-09 |
| 5658664 | Thin gold-alloy wire for semiconductor device | Tomohiro Uno, Osamu Kitamura | 1997-08-19 |
| 5491034 | Bonding wire for semiconductor element | Yoshio Ohzeki | 1996-02-13 |
| 5227662 | Composite lead frame and semiconductor device using the same | Yoshio Ohzeki | 1993-07-13 |
| 5164336 | Method of connecting TAB tape to semiconductor chip, and bump sheet and bumped tape used in the method | Tadakatsu Maruyama, Hiroaki Otsuka, Hiroyuki Tanahashi | 1992-11-17 |
| 5114878 | Method of bonding bumps to leads of tab tape and an apparatus for arranging bumps used for the same | Tadakatsu Maruyama, Masashi Konda, Tosiharu Kikuchi, Yasuhiro Suzuki, Tomohiro Uno +2 more | 1992-05-19 |
| 4379482 | Prevention of cracking of continuously cast steel slabs containing boron | Hiroo Suzuki, Koichi Yamamoto, Kou Miyamura | 1983-04-12 |