Issued Patents All Time
Showing 1–14 of 14 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 9333693 | Method for producing aliphatic polyester film | Hideyuki Yamauchi, Junichi Masuda, Yoshikazu Endo | 2016-05-10 |
| 7885752 | Control system for internal combustion engine | Kazunori Kawamura, Futoshi Nishioka | 2011-02-08 |
| 7725245 | Throttle valve control system for internal combustion engine | Kazunori Kawamura, Futoshi Nishioka | 2010-05-25 |
| 6574954 | Electronic control unit for controlling ignition timing during reduction of NOx occluded by lean NOx catalyst | Masayuki Wakui, Junichi Suzuki, Masayuki Ueno | 2003-06-10 |
| 6545337 | Semiconductor integrated circuit device | Tadayoshi Takada, Shigeaki Okawa, Hirotsugu Hata, Chikao Fujinuma | 2003-04-08 |
| 6528379 | Method for manufacturing semiconductor integrated circuit device | Tadayoshi Takada, Shigeaki Okawa, Hirotsugu Hata, Chikao Fujinuma | 2003-03-04 |
| 5989364 | Gold-alloy bonding wire | — | 1999-11-23 |
| 5793199 | Method and apparatus for determining magnetic powder concentration by using the electromagnetic induction method | Riichiro Kasahara, Yoshihisa Nozawa, Masanori Miyoshi | 1998-08-11 |
| 5761779 | Method of producing fine metal spheres of uniform size | Tadakatsu Maruyama, Yasuhide Ohno, Tosiharu Kikuchi, Yasuhiro Suzuki, Hisao Kuribayashi +1 more | 1998-06-09 |
| 5658664 | Thin gold-alloy wire for semiconductor device | Tomohiro Uno, Yasuhide Ohno | 1997-08-19 |
| 5637274 | Palladium alloy thin wire for wire bonding semiconductor elements | — | 1997-06-10 |
| 5254215 | Dry etching method | Shingo Terakado | 1993-10-19 |
| 4298050 | Process for continuous casting of a slightly deoxidized steel slab | Tetsro Ohashi, Hiromu Fujii, Seizo Mineyuki, Eiichi Takeuchi | 1981-11-03 |
| 4250596 | Fastening system for securing a trim-fixing device to a substrate | Kunio Hara, Katsuji Yamaguchi | 1981-02-17 |