Issued Patents All Time
Showing 1–25 of 27 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 11810885 | Semiconductor element bonding structure, method for producing semiconductor element bonding structure, and electrically conductive bonding agent | Yasunori Tanaka | 2023-11-07 |
| 11152286 | Power semiconductor module device | — | 2021-10-19 |
| 10903146 | Electrode connection structure, lead frame, and method for forming electrode connection structure | Kazutoshi Ueda, Nobuaki Sato, Koji Shimizu | 2021-01-26 |
| 9960140 | Metal joining structure using metal nanoparticles and metal joining method and metal joining material | Shinji Ishikawa, Norie MATSUBARA, Masamoto Tanaka | 2018-05-01 |
| 9601448 | Electrode connection structure and electrode connection method | — | 2017-03-21 |
| 9059003 | Power semiconductor device, method of manufacturing the device and bonding wire | Takashi Yamada, Daizo Oda | 2015-06-16 |
| 8104663 | Solder ball mounting method and apparatus | Shinji Ishikawa, Eiji Hashino | 2012-01-31 |
| 8097960 | Semiconductor mounting bonding wire | Shinichi Terashima, Tomohiro Uno, Takashi Yamada, Atsuo Ikeda, Daizo Oda | 2012-01-17 |
| 8044408 | SiC single-crystal substrate and method of producing SiC single-crystal substrate | Tatsuo Fujimoto, Taizo Hoshino, Masakazu Katsuno, Noboru Ohtani, Masashi Nakabayashi +3 more | 2011-10-25 |
| 7969021 | Bonding wire for semiconductor device and method for producing the same | Tomohiro Uno, Shinichi Terashima | 2011-06-28 |
| 7390370 | Gold bonding wires for semiconductor devices and method of producing the wires | Tomohiro Uno, Shinichi Terashima | 2008-06-24 |
| 7285486 | Ball transferring method and apparatus | Kenji Shimokawa, Eiji Hashino | 2007-10-23 |
| 7045389 | Method for fabricating a semiconductor devices provided with low melting point metal bumps | Kenji Shimokawa, Eiji Hashino | 2006-05-16 |
| 7045388 | Semiconductor device provided with low melting point metal bumps | Kenji Shimokawa, Eiji Hashino | 2006-05-16 |
| 6916731 | Ball transferring method and apparatus | Kenji Shimokawa, Eiji Hashino | 2005-07-12 |
| 6909182 | Spherical semiconductor device and method for fabricating the same | Kenji Shimokawa, Eiji Hashino, Nobuo Takeda, Atsuyuki Fukano | 2005-06-21 |
| 6884708 | Method of partially plating substrate for electronic devices | Kenji Shimokawa, Eiji Hashino | 2005-04-26 |
| 6571007 | Ball-arranging substrate for forming bump, ball-arranging head, ball-arranging device, and ball-arranging method | Kenji Shimokawa, Eiji Hashino | 2003-05-27 |
| 6509645 | Spherical semiconductor device and method for fabricating the same | Kenji Shimokawa, Eiji Hashino, Nobuo Takeda, Atsuyuki Fukano | 2003-01-21 |
| 6210637 | Gold alloy thin wire for semiconductor devices | Tomohiro Uno | 2001-04-03 |
| 6080492 | Gold alloy thin wire for semiconductor devices | Tomohiro Uno | 2000-06-27 |
| 5857610 | Process and apparatus for forming ball bumps | Hiroshi Hoshiba, Masashi Konda, Yoji Kawakami | 1999-01-12 |
| 5803339 | Process and apparatus for forming ball bumps | Hiroshi Hoshiba, Masashi Konda, Yoji Kawakami | 1998-09-08 |
| 5687901 | Process and apparatus for forming ball bumps | Hiroshi Hoshiba, Masashi Konda, Yoji Kawakami | 1997-11-18 |
| 5639558 | Insulating resin-coated bonding wire | Hiroyuki Kondo, Michio Nitta, Shinya Nariki | 1997-06-17 |