Issued Patents All Time
Showing 1–13 of 13 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 8847390 | Lead-free solder bump bonding structure | Shinji Ishikawa, Shinichi Terashima, Masamoto Tanaka | 2014-09-30 |
| 8104663 | Solder ball mounting method and apparatus | Shinji Ishikawa, Kohei Tatsumi | 2012-01-31 |
| 7465217 | CMP conditioner, method for arranging hard abrasive grains for use in CMP conditioner, and process for producing CMP conditioner | Toshiya Kinoshita, Setsuo Sato, Ryuichi Araki | 2008-12-16 |
| 7285486 | Ball transferring method and apparatus | Kenji Shimokawa, Kohei Tatsumi | 2007-10-23 |
| 7045388 | Semiconductor device provided with low melting point metal bumps | Kohei Tatsumi, Kenji Shimokawa | 2006-05-16 |
| 7045389 | Method for fabricating a semiconductor devices provided with low melting point metal bumps | Kohei Tatsumi, Kenji Shimokawa | 2006-05-16 |
| 6916731 | Ball transferring method and apparatus | Kenji Shimokawa, Kohei Tatsumi | 2005-07-12 |
| 6909182 | Spherical semiconductor device and method for fabricating the same | Kohei Tatsumi, Kenji Shimokawa, Nobuo Takeda, Atsuyuki Fukano | 2005-06-21 |
| 6884708 | Method of partially plating substrate for electronic devices | Kohei Tatsumi, Kenji Shimokawa | 2005-04-26 |
| 6571007 | Ball-arranging substrate for forming bump, ball-arranging head, ball-arranging device, and ball-arranging method | Kenji Shimokawa, Kohei Tatsumi | 2003-05-27 |
| 6509645 | Spherical semiconductor device and method for fabricating the same | Kohei Tatsumi, Kenji Shimokawa, Nobuo Takeda, Atsuyuki Fukano | 2003-01-21 |
| 5899376 | Transfer of flux onto electrodes and production of bumps on electrodes | Kouhei Tatumi, Kenji Shimokawa | 1999-05-04 |
| 5765744 | Production of small metal bumps | Kouhei Tatumi, Kenji Shimokawa | 1998-06-16 |