Issued Patents All Time
Showing 1–17 of 17 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 11198918 | Stainless steel foil and method of production of same | Hiroto Unno, Toru Inaguma, Koichi Nose, Naoki Fujimoto, Naoya SAWAKI +1 more | 2021-12-14 |
| 11101234 | Cu pillar cylindrical preform for semiconductor connection | Takashi Yamada, Daizo Oda, Teruo Haibara | 2021-08-24 |
| 9902134 | Metal foil for base material and producing method thereof | Takayuki Kobayashi, Masamoto Tanaka, Masami Fujishima, Masao Kurosaki, Jun Maki +2 more | 2018-02-27 |
| 9427830 | Copper alloy bonding wire for semiconductor | Tomohiro Uno, Takashi Yamada, Daizo Oda | 2016-08-30 |
| 9320152 | Solder ball and electronic member | Takayuki Kobayashi, Masamoto Tanaka, Katsuichi Kimura, Tadayuki Sagawa | 2016-04-19 |
| 9296180 | Metal foil for base material | Takayuki Kobayashi, Masamoto Tanaka, Masami Fujishima, Masao Kurosaki, Jun Maki +2 more | 2016-03-29 |
| 9112059 | Bonding wire for semiconductor device | Tomohiro Uno, Keiichi Kimura, Takashi Yamada, Akihito Nishibayashi | 2015-08-18 |
| 9024442 | Solder ball for semiconductor packaging and electronic member using the same | Masamoto Tanaka, Katsuichi Kimura | 2015-05-05 |
| 8847390 | Lead-free solder bump bonding structure | Eiji Hashino, Shinji Ishikawa, Masamoto Tanaka | 2014-09-30 |
| 8815019 | Bonding wire for semiconductor | Tomohiro Uno, Takashi Yamada, Ryo OISHI, Daizo Oda | 2014-08-26 |
| 8742258 | Bonding wire for semiconductor | Tomohiro Uno, Takashi Yamada, Daizo Oda | 2014-06-03 |
| 8247911 | Wire bonding structure and method for forming same | Tomohiro Uno, Keiichi Kimura, Takashi Yamada, Akihito Nishibayashi | 2012-08-21 |
| 8102061 | Semiconductor device bonding wire and wire bonding method | Tomohiro Uno, Keiichi Kimura, Takashi Yamada, Akihito Nishibayashi | 2012-01-24 |
| 8097960 | Semiconductor mounting bonding wire | Tomohiro Uno, Kohei Tatsumi, Takashi Yamada, Atsuo Ikeda, Daizo Oda | 2012-01-17 |
| 7969021 | Bonding wire for semiconductor device and method for producing the same | Tomohiro Uno, Kohei Tatsumi | 2011-06-28 |
| 7390370 | Gold bonding wires for semiconductor devices and method of producing the wires | Tomohiro Uno, Kohei Tatsumi | 2008-06-24 |
| 7124858 | Brake system | Hiroshi Ikegami, Hitoshi Furukawa, Minoru Mashiko | 2006-10-24 |