Issued Patents All Time
Showing 1–13 of 13 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 12157189 | Junction structure, method for manufacturing junction structure, and solder ball | Kiyotsugu Komori, Keisuke AKASHI, Katsuhiko Hoshino, Tsunekazu Yamazaki, Takayuki Kobayashi +2 more | 2024-12-03 |
| 9960140 | Metal joining structure using metal nanoparticles and metal joining method and metal joining material | Kohei Tatsumi, Shinji Ishikawa, Norie MATSUBARA | 2018-05-01 |
| 9902134 | Metal foil for base material and producing method thereof | Takayuki Kobayashi, Shinichi Terashima, Masami Fujishima, Masao Kurosaki, Jun Maki +2 more | 2018-02-27 |
| 9382603 | Metal tape material and interconnector for solar module current collection | Keiichi Kimura, Wataru Ohashi | 2016-07-05 |
| 9320152 | Solder ball and electronic member | Shinichi Terashima, Takayuki Kobayashi, Katsuichi Kimura, Tadayuki Sagawa | 2016-04-19 |
| 9296180 | Metal foil for base material | Shinichi Terashima, Takayuki Kobayashi, Masami Fujishima, Masao Kurosaki, Jun Maki +2 more | 2016-03-29 |
| 9024442 | Solder ball for semiconductor packaging and electronic member using the same | Shinichi Terashima, Katsuichi Kimura | 2015-05-05 |
| 8847390 | Lead-free solder bump bonding structure | Eiji Hashino, Shinji Ishikawa, Shinichi Terashima | 2014-09-30 |
| 8562906 | Lead-free solder alloy, solder ball and electronic member, and lead-free solder alloy, solder ball and electronic member for automobile-mounted electronic member | Tsutomu Sasaki, Takayuki Kobayashi, Kazuto Kawakami, Masayoshi Fujishima | 2013-10-22 |
| 8501088 | Solder alloy, solder ball and electronic member having solder bump | Takayuki Kobayashi, Tsutomu Sasaki, Katsuichi Kimura | 2013-08-06 |
| 6926860 | Method and apparatus for manufacturing minute metallic sphere | Michio Endo | 2005-08-09 |
| 6676726 | Method and apparatus for manufacturing minute metallic sphere | Michio Endo | 2004-01-13 |
| 5308799 | Oxide superconductor and process for preparation thereof | Mitsuru Morita, Keiichi Kimura, Katsuyoshi Miyamoto, Kiyoshi Sawano, Seiki Takebayashi | 1994-05-03 |