Issued Patents All Time
Showing 1–3 of 3 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 9320152 | Solder ball and electronic member | Shinichi Terashima, Takayuki Kobayashi, Masamoto Tanaka, Tadayuki Sagawa | 2016-04-19 |
| 9024442 | Solder ball for semiconductor packaging and electronic member using the same | Shinichi Terashima, Masamoto Tanaka | 2015-05-05 |
| 8501088 | Solder alloy, solder ball and electronic member having solder bump | Takayuki Kobayashi, Tsutomu Sasaki, Masamoto Tanaka | 2013-08-06 |