Issued Patents All Time
Showing 1–25 of 35 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 12412864 | Bonding wire for semiconductor devices | Daizo Oda, Takumi Ohkabe, Takashi Yamada, Tetsuya OYAMADA, Tomohiro Uno | 2025-09-09 |
| 12388044 | Al bonding wire | Takashi Yamada, Akihito Nishibayashi, Daizo Oda, Motoki ETO, Tetsuya OYAMADA +2 more | 2025-08-12 |
| 12300658 | Copper alloy bonding wire for semiconductor devices | Daizo Oda, Takashi Yamada, Motoki ETO, Tomohiro Uno | 2025-05-13 |
| 12132025 | Bonding wire | Takashi Yamada, Akihito Nishibayashi, Daizo Oda, Motoki ETO, Tetsuya OYAMADA +2 more | 2024-10-29 |
| 12090578 | Al bonding wire | Takashi Yamada, Akihito Nishibayashi, Daizo Oda, Motoki ETO, Tetsuya OYAMADA +2 more | 2024-09-17 |
| 11929343 | Bonding wire for semiconductor devices | Daizo Oda, Motoki ETO, Takashi Yamada, Ryo OISHI | 2024-03-12 |
| 11721660 | Bonding wire for semiconductor devices | Daizo Oda, Motoki ETO, Takashi Yamada, Ryo OISHI | 2023-08-08 |
| 11373934 | Bonding wire for semiconductor device | Daizo Oda, Takashi Yamada, Motoki ETO, Tomohiro Uno | 2022-06-28 |
| 11342299 | Bonding wire for semiconductor devices | Daizo Oda, Takumi Ohkabe, Takashi Yamada, Tetsuya OYAMADA, Tomohiro Uno | 2022-05-24 |
| 11101234 | Cu pillar cylindrical preform for semiconductor connection | Takashi Yamada, Daizo Oda, Shinichi Terashima | 2021-08-24 |
| 10737356 | Bonding wire for semiconductor device | Takashi Yamada, Daizo Oda, Ryo OISHI, Kazuyuki Saito, Tomohiro Uno | 2020-08-11 |
| 10672733 | Cu alloy core bonding wire with Pd coating for semiconductor device | Takashi Yamada, Daizo Oda, Tomohiro Uno | 2020-06-02 |
| 10610976 | Bonding wire for semiconductor device | Takashi Yamada, Daizo Oda, Ryo OISHI, Kazuyuki Saito, Tomohiro Uno | 2020-04-07 |
| 10497663 | Cu alloy core bonding wire with Pd coating for semiconductor device | Takashi Yamada, Daizo Oda, Tomohiro Uno | 2019-12-03 |
| 10414002 | Bonding wire for semiconductor device | Takashi Yamada, Daizo Oda, Ryo OISHI, Kazuyuki Saito, Tomohiro Uno | 2019-09-17 |
| 10236272 | Cu alloy core bonding wire with Pd coating for semiconductor device | Takashi Yamada, Daizo Oda, Tomohiro Uno | 2019-03-19 |
| 10137483 | Ultrasonic cleaning method | Yoshihiro Mori, Etsuko Kubo, Masashi Uchibe | 2018-11-27 |
| 10137534 | Bonding wire for semiconductor device | Takashi Yamada, Daizo Oda, Ryo OISHI, Kazuyuki Saito, Tomohiro Uno | 2018-11-27 |
| 10121649 | Cleaning method of semiconductor wafer | — | 2018-11-06 |
| 10121758 | Bonding wire for semiconductor device | Daizo Oda, Motoki ETO, Kazuyuki Saito, Ryo OISHI, Takashi Yamada +1 more | 2018-11-06 |
| 10121764 | Method for forming ball in bonding wire | Noritoshi Araki, Takashi Yamada, Ryo OISHI, Tomohiro Uno | 2018-11-06 |
| 10032741 | Bonding wire for semiconductor device | Daizo Oda, Motoki ETO, Takashi Yamada, Ryo OISHI, Tomohiro Uno +1 more | 2018-07-24 |
| 9887172 | Bonding wire for semiconductor device | Daizo Oda, Motoki ETO, Kazuyuki Saito, Ryo OISHI, Takashi Yamada +1 more | 2018-02-06 |
| 9773688 | Ultrasonic cleaning method and ultrasonic cleaning apparatus | Etsuko Kubo, Yoshihiro Mori, Masashi Uchibe | 2017-09-26 |
| 9662687 | Ultrasonic cleaning method | Yoshihiro Mori, Etsuko Kubo, Masashi Uchibe | 2017-05-30 |