Issued Patents All Time
Showing 1–21 of 21 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 12325901 | AI wiring material | Yuto KURIHARA, Motoki ETO, Daizo Oda, Tetsuya OYAMADA, Yuya SUTO +1 more | 2025-06-10 |
| 12290883 | Bonding wire | Daizo Oda, Motoki ETO | 2025-05-06 |
| 11929343 | Bonding wire for semiconductor devices | Daizo Oda, Motoki ETO, Takashi Yamada, Teruo Haibara | 2024-03-12 |
| 11721660 | Bonding wire for semiconductor devices | Daizo Oda, Motoki ETO, Takashi Yamada, Teruo Haibara | 2023-08-08 |
| 10737356 | Bonding wire for semiconductor device | Takashi Yamada, Daizo Oda, Teruo Haibara, Kazuyuki Saito, Tomohiro Uno | 2020-08-11 |
| 10610976 | Bonding wire for semiconductor device | Takashi Yamada, Daizo Oda, Teruo Haibara, Kazuyuki Saito, Tomohiro Uno | 2020-04-07 |
| 10468370 | Bonding wire for semiconductor device | Takashi Yamada, Daizo Oda, Tomohiro Uno | 2019-11-05 |
| 10414002 | Bonding wire for semiconductor device | Takashi Yamada, Daizo Oda, Teruo Haibara, Kazuyuki Saito, Tomohiro Uno | 2019-09-17 |
| 10137534 | Bonding wire for semiconductor device | Takashi Yamada, Daizo Oda, Teruo Haibara, Kazuyuki Saito, Tomohiro Uno | 2018-11-27 |
| 10121758 | Bonding wire for semiconductor device | Daizo Oda, Motoki ETO, Kazuyuki Saito, Teruo Haibara, Takashi Yamada +1 more | 2018-11-06 |
| 10121764 | Method for forming ball in bonding wire | Noritoshi Araki, Takashi Yamada, Teruo Haibara, Tomohiro Uno | 2018-11-06 |
| 10032741 | Bonding wire for semiconductor device | Daizo Oda, Motoki ETO, Takashi Yamada, Teruo Haibara, Tomohiro Uno +1 more | 2018-07-24 |
| 9887172 | Bonding wire for semiconductor device | Daizo Oda, Motoki ETO, Kazuyuki Saito, Teruo Haibara, Takashi Yamada +1 more | 2018-02-06 |
| 9773748 | Bonding wire for semiconductor device | Takashi Yamada, Daizo Oda, Tomohiro Uno | 2017-09-26 |
| 9543266 | Bonding wire for semiconductor device use and method of production of same | Takashi Yamada, Daizo Oda, Teruo Haibara, Tomohiro Uno | 2017-01-10 |
| 9536854 | Bonding wire for semiconductor device use and method of production of same | Takashi Yamada, Daizo Oda, Teruo Haibara, Tomohiro Uno | 2017-01-03 |
| D743918 | Light emitting diode | Takayuki Igarashi | 2015-11-24 |
| 8815019 | Bonding wire for semiconductor | Tomohiro Uno, Shinichi Terashima, Takashi Yamada, Daizo Oda | 2014-08-26 |
| D661262 | Light emitting diode | Takayuki Igarashi, Toshimasa Takao, Tetsuya Yagi | 2012-06-05 |
| 6488888 | Lead-free solder alloys | Toshikazu Murata, Hiroji Noguchi, Sadao Kishida, Toshihiko Taguchi, Shozo Asano +1 more | 2002-12-03 |
| 6241942 | Lead-free solder alloys | Toshikazu Murata, Hiroji Noguchi, Sadao Kishida, Toshihiko Taguchi, Shozo Asano +1 more | 2001-06-05 |