Issued Patents All Time
Showing 1–19 of 19 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 12412864 | Bonding wire for semiconductor devices | Daizo Oda, Takumi Ohkabe, Teruo Haibara, Takashi Yamada, Tomohiro Uno | 2025-09-09 |
| 12388044 | Al bonding wire | Takashi Yamada, Akihito Nishibayashi, Teruo Haibara, Daizo Oda, Motoki ETO +2 more | 2025-08-12 |
| 12334467 | Copper bonding wire | Tomohiro Uno, Daizo Oda, Kota Shimomura, Tadashi Yamaguchi | 2025-06-17 |
| 12325901 | AI wiring material | Yuto KURIHARA, Ryo OISHI, Motoki ETO, Daizo Oda, Yuya SUTO +1 more | 2025-06-10 |
| 12166006 | Bonding wire for semiconductor devices | Tomohiro Uno, Daizo Oda, Motoki ETO | 2024-12-10 |
| 12132025 | Bonding wire | Takashi Yamada, Akihito Nishibayashi, Teruo Haibara, Daizo Oda, Motoki ETO +2 more | 2024-10-29 |
| 12090578 | Al bonding wire | Takashi Yamada, Akihito Nishibayashi, Teruo Haibara, Daizo Oda, Motoki ETO +2 more | 2024-09-17 |
| 11612966 | Ag alloy bonding wire for semiconductor device | Tomohiro Uno, Daizo Oda, Motoki ETO, Takumi Ohkabe | 2023-03-28 |
| 11342299 | Bonding wire for semiconductor devices | Daizo Oda, Takumi Ohkabe, Teruo Haibara, Takashi Yamada, Tomohiro Uno | 2022-05-24 |
| 10991672 | Cu alloy bonding wire for semiconductor device | Tomohiro Uno, Takashi Yamada, Daizo Oda | 2021-04-27 |
| 10985130 | Cu alloy bonding wire for semiconductor device | Tomohiro Uno, Takashi Yamada, Daizo Oda | 2021-04-20 |
| 10950570 | Bonding wire for semiconductor device | Tomohiro Uno, Hiroyuki Deai | 2021-03-16 |
| 10950571 | Bonding wire for semiconductor device | Tomohiro Uno, Takashi Yamada, Daizo Oda, Motoki ETO | 2021-03-16 |
| 10840208 | Bonding wire for semiconductor device | Tomohiro Uno, Daizo Oda, Takashi Yamada | 2020-11-17 |
| 10790259 | Cu alloy bonding wire for semiconductor device | Tomohiro Uno, Takashi Yamada, Daizo Oda | 2020-09-29 |
| 10529683 | Bonding wire for semiconductor device | Tomohiro Uno, Daizo Oda, Takashi Yamada | 2020-01-07 |
| 10381320 | Silver bonding wire for semiconductor device containing indium, gallium, and/or cadmium | Tomohiro Uno, Hiroyuki Deai, Daizo Oda | 2019-08-13 |
| 10032741 | Bonding wire for semiconductor device | Daizo Oda, Motoki ETO, Takashi Yamada, Teruo Haibara, Ryo OISHI +1 more | 2018-07-24 |
| 9812421 | Bonding wire for semiconductor devices | Tomohiro Uno, Yoshiaki Hagiwara, Daizo Oda | 2017-11-07 |