Issued Patents All Time
Showing 1–5 of 5 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 12145852 | Silica spherical particles for semiconductor sealing material | Katsumasa YAGI, Dota Saito, Mutsuhito TANAKA, Masanori AE | 2024-11-19 |
| 10950570 | Bonding wire for semiconductor device | Tetsuya OYAMADA, Tomohiro Uno | 2021-03-16 |
| 10526722 | Method for manufacturing silicon carbide single crystal | Masashi Nakabayashi, Kiyoshi Kojima, Kota Shimomura, Yukio Nagahata | 2020-01-07 |
| 10381320 | Silver bonding wire for semiconductor device containing indium, gallium, and/or cadmium | Tetsuya OYAMADA, Tomohiro Uno, Daizo Oda | 2019-08-13 |
| 8043929 | Semiconductor substrate and method for production thereof | Josef X. Brunner, Atsushi Ikari, Martin Grassl, Atsuki Matsumura, Wilfried von Ammon | 2011-10-25 |