Issued Patents All Time
Showing 1–4 of 4 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 12334467 | Copper bonding wire | Tomohiro Uno, Tetsuya OYAMADA, Daizo Oda, Tadashi Yamaguchi | 2025-06-17 |
| 10526722 | Method for manufacturing silicon carbide single crystal | Masashi Nakabayashi, Kiyoshi Kojima, Hiroyuki Deai, Yukio Nagahata | 2020-01-07 |
| 10202706 | Silicon carbide single crystal wafer and method of manufacturing a silicon carbide single crystal ingot | Masashi Nakabayashi, Yukio Nagahata, Kiyoshi Kojima | 2019-02-12 |
| 10031089 | Method for evaluating internal stress of silicon carbide monocrystalline wafer and method for predicting warpage in silicone carbide monocrystalline wafer | Kiyoshi Kojima, Masashi Nakabayashi, Yukio Nagahata | 2018-07-24 |