Issued Patents All Time
Showing 1–3 of 3 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 12412864 | Bonding wire for semiconductor devices | Daizo Oda, Teruo Haibara, Takashi Yamada, Tetsuya OYAMADA, Tomohiro Uno | 2025-09-09 |
| 11612966 | Ag alloy bonding wire for semiconductor device | Tetsuya OYAMADA, Tomohiro Uno, Daizo Oda, Motoki ETO | 2023-03-28 |
| 11342299 | Bonding wire for semiconductor devices | Daizo Oda, Teruo Haibara, Takashi Yamada, Tetsuya OYAMADA, Tomohiro Uno | 2022-05-24 |