Issued Patents All Time
Showing 1–7 of 7 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 12388044 | Al bonding wire | Takashi Yamada, Teruo Haibara, Daizo Oda, Motoki ETO, Tetsuya OYAMADA +2 more | 2025-08-12 |
| 12132025 | Bonding wire | Takashi Yamada, Teruo Haibara, Daizo Oda, Motoki ETO, Tetsuya OYAMADA +2 more | 2024-10-29 |
| 12090578 | Al bonding wire | Takashi Yamada, Teruo Haibara, Daizo Oda, Motoki ETO, Tetsuya OYAMADA +2 more | 2024-09-17 |
| 9112059 | Bonding wire for semiconductor device | Tomohiro Uno, Keiichi Kimura, Shinichi Terashima, Takashi Yamada | 2015-08-18 |
| 8247911 | Wire bonding structure and method for forming same | Tomohiro Uno, Shinichi Terashima, Keiichi Kimura, Takashi Yamada | 2012-08-21 |
| 8102061 | Semiconductor device bonding wire and wire bonding method | Tomohiro Uno, Keiichi Kimura, Shinichi Terashima, Takashi Yamada | 2012-01-24 |
| 6294411 | Method for molding a semiconductor device utilizing a satin finish | — | 2001-09-25 |