KT

Kohei Tatsumi

NS Nippon Steel: 17 patents #85 of 4,423Top 2%
WU Waseda University: 6 patents #13 of 411Top 4%
NC Nippon Steel Materials Co.: 3 patents #4 of 34Top 15%
TI Texas Instruments: 2 patents #5,248 of 12,488Top 45%
NM Nippon Micrometal: 2 patents #16 of 39Top 45%
BS Ball Semiconductor: 2 patents #24 of 63Top 40%
MH Mitsui High-Tec: 1 patents #93 of 174Top 55%
NM Nippon Steel & Sumitomo Metal: 1 patents #786 of 1,491Top 55%
Overall (All Time): #144,942 of 4,157,543Top 4%
27
Patents All Time

Issued Patents All Time

Showing 26–27 of 27 patents

Patent #TitleCo-InventorsDate
5554443 Bonding wire with heat and abrasion resistant coating layers Hiroyuki Kondo, Masao Kimura, Kiyoshi Onodera 1996-09-10
5415922 Resin-coated bonding device Hiroyuki Kondo, Ryoichi Suzuki, Toru Bando, Soichi Kadoguchi 1995-05-16