Issued Patents All Time
Showing 1–2 of 2 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 5188280 | Method of bonding metals, and method and apparatus for producing semiconductor integrated circuit device using said method of bonding metals | Takashi Nakao, Yoshiaki Emoto, Masayuki Iketani, Kunizo Sahara, Ikuo Yoshida +6 more | 1993-02-23 |
| 5090609 | Method of bonding metals, and method and apparatus for producing semiconductor integrated circuit device using said method of bonding metals | Takashi Nakao, Yoshiaki Emoto, Masayuki Iketani, Kunizo Sahara, Ikuo Yoshida +6 more | 1992-02-25 |