Issued Patents All Time
Showing 1–2 of 2 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 4854495 | Sealing structure, method of soldering and process for preparing sealing structure | Akihiko Yamamoto, Akiomi Kohno, Toshihiri Yamada, Keiji Taguchi, Kazuaki Yokoi | 1989-08-08 |
| 4749118 | Method for bonding ceramic to metal | Kazuaki Yokoi, Toshihiro Yamada, Akiomi Kohno, Hiroyuki Kawamoto | 1988-06-07 |