Issued Patents All Time
Showing 25 most recent of 32 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 6101837 | Ice thermal storage type air-conditioner and ice thermal storage tank | Masao Imanari, Toshihiko Fukushima, Katsumi Matsubara, Naoto Katsumata | 2000-08-15 |
| 6050328 | Heat exchanger and air conditioner using same | Naoki Shikazono, Masaaki Itoh, Hideyuki Kimura, Sumiyoshi Takeda, Kensaku Oguni +4 more | 2000-04-18 |
| 5959351 | Liquid-cooled electronic device | Shigeyuki Sasaki, Tadakatsu Nakajima, Noriyuki Ashiwake, Yasuo Ohsone, Toshiki Iino +2 more | 1999-09-28 |
| 5934368 | Air-cooled electronic apparatus with condensation prevention | Tetsuya Tanaka, Takayuki Atarashi, Junichi Kobayashi, Akihiro Takanashi, Takahiro Daikoku +2 more | 1999-08-10 |
| 5796580 | Air-cooled information processing apparatus having cooling air fan, sub-fan, and plural separated cooling air flow channels | Toshihiro Komatsu, Hitoshi Matsushima, Susumu Iwai, Tetsuro Homma, Yoshihiro Kondo +7 more | 1998-08-18 |
| 5774334 | Low thermal resistant, fluid-cooled semiconductor module | Keizo Kawamura, Noriyuki Ashiwake, Takahiro Daikoku, Akio Idei, Kenichi Kasai +3 more | 1998-06-30 |
| 5764483 | Cooling unit for electronic equipment | Shigeo Ohashi, Shinji Tanaka | 1998-06-09 |
| 5705850 | Semiconductor module | Noriyuki Ashiwake, Takahiro Daikoku, Kenichi Kasai, Keizou Kawamura, Hideyuki Kimura +2 more | 1998-01-06 |
| 5646824 | Electronic equipment and lap-top type electronic equipment | Shigeo Ohashi, Takeo Tanaka, Susumu Iwai | 1997-07-08 |
| 5592363 | Electronic apparatus | Takayuki Atarashi, Takahiro Daikoku, Nobuo Kawasaki, Toshiki Iino, Tamotsu Tsukaguchi +3 more | 1997-01-07 |
| 5558493 | Forced air cooling apparatus having blower and air current regulating plate that reduces eddy air current at inlet of blower | Yutaka Hayashi, Mitsuo Miyamoto, Michihito Watarai, Takayuki Atarashi, Tetsuya Tanaka +2 more | 1996-09-24 |
| 5504651 | Cooling apparatus for electronic equipment | Takayuki Atarashi, Tetsuya Tanaka, Toshiki Iino, Kenichi Kasai, Takahiro Daikoku +1 more | 1996-04-02 |
| 5504924 | Cooling system of electronic computer using flexible members in contact with semiconductor devices on boards | Shingeo Ohashi, Tadakatsu Nakajima, Heikichi Kuwahara, Hitoshi Matsushima, Motohiro Sato +3 more | 1996-04-02 |
| 5488255 | Cooling device for semiconductor packages, having flexible film heat expulsion means | Kazuo Sato, Mitsuhiro Shikida, Shigeo Ohashi, Noriyuki Ashiwake, Shinji Tanaka +2 more | 1996-01-30 |
| 5428503 | Jet cooling apparatus for cooling electronic equipment and computer having the same mounted thereon | Hitoshi Matsushima, Toshihiro Komatu, Yoshihiro Kondou, Susumu Iwai, Tetsuro Honma +3 more | 1995-06-27 |
| 5406807 | Apparatus for cooling semiconductor device and computer having the same | Noriyuki Ashiwake, Tadakatsu Nakajima, Shigeyuki Sasaki, Yasuo Ohsone, Toshiki Iino +2 more | 1995-04-18 |
| 5365402 | Cooling apparatus of electronic device | Shigeo Ohashi, Tadakatsu Nakajima, Heikichi Kuwahara, Hitoshi Matsushima, Motohiro Sato +5 more | 1994-11-15 |
| 5360060 | Fin-tube type heat exchanger | Takeo Tanaka, Masaaki Itoh, Takao Senshu, Naoto Katsumata, Yoshihiko MOCHIZUKI +5 more | 1994-11-01 |
| 5361188 | Cooling apparatus of electronic equipment | Yoshihiro Kondou, Hitoshi Matsushima, Hiroshi Inouye, Toshihiro Komatsu, Takao Ohba +1 more | 1994-11-01 |
| 5358032 | LSI package cooling heat sink, method of manufacturing the same and LSI package to which the heat sink is mounted | Masatsugu Arai, Akiomi Kohno, Yoshihiro Kondo, Toshihiro Komatsu, Kanji Otsuka +2 more | 1994-10-25 |
| 5353866 | Heat transfer fins and heat exchanger | Hironobu Ueda, Yoshifumi Kunugi, Tomihisa Oouchi, Sigeo Sugimoto, Tamio Shimizu +1 more | 1994-10-11 |
| 5315482 | Semiconductor apparatus of module installing type | Akira Tanaka, Hiroichi Shinohara, Kazuji Yamada, Takao Ohba, Akira Yamagiwa +4 more | 1994-05-24 |
| 5313362 | Packaging structure of small-sized computer | Hiroshi Inouye, Takao Ohba, Susumu Iwai | 1994-05-17 |
| 5270572 | Liquid impingement cooling module for semiconductor devices | Tadakatsu Nakajima, Shigeo Ohashi, Heikichi Kuwahara, Noriyuki Ashiwake, Motohiro Sato +6 more | 1993-12-14 |
| 5195576 | LSI cooling apparatus and computer cooling apparatus | Hitoshi Matsushima, Yoshihiro Kondou, Hiroshi Inoue, Kanji Otsuka, Yuji Shirai +2 more | 1993-03-23 |