Issued Patents All Time
Showing 1–25 of 60 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 11172103 | Heat-resistant imaging camera that moves in a high temperature furnace | Keigo Nakamura, Takeshi Kashiyama, Yoshiyuki Murano | 2021-11-09 |
| 11044838 | Railway equipment inspecting and measuring apparatus, and railway equipment inspecting and measuring method | Hideyasu Suzuki, Takeshi Kurokawa, Tomohiko Kai, Masaki Araki, Tomoya Sasaki +4 more | 2021-06-22 |
| 10532401 | Liquid-cooling cold plate and method for manufacturing same | Satoru Ujiie | 2020-01-14 |
| 10421299 | Sheet supplying apparatus and printing apparatus | Masashi Kamada, Masato Eiyama, Yuki Igarashi, Masashi Negishi, Ryoya Shinjo +2 more | 2019-09-24 |
| 7518233 | Sealing structure for multi-chip module | Kouichi Takahashi, Kenichi Kasai, Takayuki Uda, Toshitada Netsu, Takeshi Yamaguchi +2 more | 2009-04-14 |
| 6890799 | Device for sealing and cooling multi-chip modules | Kenichi Kasai, Toshitada Netsu, Koichi Koyano, Takayuki Uda | 2005-05-10 |
| 6711017 | Cooling apparatus for electronic unit | Tateki Kurokawa, Akira Saito, Toshio Fukukawa, Mikio Harada, Hideo Yazawa | 2004-03-23 |
| 6632780 | Highly thermal conductive grease composition and cooling device using the same | Takao Uematsu, Yutaka Ito, Akio Idei, Akihiro Yasuda | 2003-10-14 |
| 6528878 | Device for sealing and cooling multi-chip modules | Kenichi Kasai, Toshitada Netsu, Koichi Koyano, Takayuki Uda | 2003-03-04 |
| 6351384 | Device and method for cooling multi-chip modules | Junri Ichikawa, Atsuo Nishihara, Kenichi Kasai | 2002-02-26 |
| 6281575 | Multi-chip module | Toru Nishikawa, Masahide Harada, Kaoru Katayama, Takeshi Miitsu, Takayuki Uda | 2001-08-28 |
| 5934368 | Air-cooled electronic apparatus with condensation prevention | Tetsuya Tanaka, Toshio Hatada, Takayuki Atarashi, Junichi Kobayashi, Akihiro Takanashi +2 more | 1999-08-10 |
| 5818694 | Cooling apparatus for electronic devices | Shigeyasu Tsubaki | 1998-10-06 |
| 5774334 | Low thermal resistant, fluid-cooled semiconductor module | Keizo Kawamura, Noriyuki Ashiwake, Akio Idei, Kenichi Kasai, Hideyuki Kimura +3 more | 1998-06-30 |
| 5751062 | Cooling device of multi-chip module | Fumiyuki Kobayashi, Noriyuki Ashiwake, Kenichi Kasai, Keizou Kawamura, Akio Idei | 1998-05-12 |
| RE35721 | Cooling device of semiconductor chips | Tadakatsu Nakajima, Noriyuki Ashiwake, Keizo Kawamura, Motohiro Sato, Fumiyuki Kobayashi +1 more | 1998-02-03 |
| 5705854 | Cooling apparatus for electronic device | Takayuki Atarashi, Tetsuya Tanaka | 1998-01-06 |
| 5705850 | Semiconductor module | Noriyuki Ashiwake, Kenichi Kasai, Keizou Kawamura, Hideyuki Kimura, Atsuo Nishihara +2 more | 1998-01-06 |
| 5689572 | Method of actively controlling noise, and apparatus thereof | Katsuo Ohki, Shinichi Shimode, Yukiji Iwase, Osamu Sekiguchi, Masanori Watanabe +2 more | 1997-11-18 |
| 5595240 | Cooling apparatus of electronic devices | Noriyuki Ashiwake, Nobuo Kawasaki, Shizuo Zushi | 1997-01-21 |
| 5592363 | Electronic apparatus | Takayuki Atarashi, Toshio Hatada, Nobuo Kawasaki, Toshiki Iino, Tamotsu Tsukaguchi +3 more | 1997-01-07 |
| 5558493 | Forced air cooling apparatus having blower and air current regulating plate that reduces eddy air current at inlet of blower | Yutaka Hayashi, Mitsuo Miyamoto, Michihito Watarai, Takayuki Atarashi, Tetsuya Tanaka +2 more | 1996-09-24 |
| 5515912 | Cooling apparatus of electronic devices | Noriyuki Ashiwake, Nobuo Kawasaki, Shizuo Zushi | 1996-05-14 |
| 5504651 | Cooling apparatus for electronic equipment | Takayuki Atarashi, Toshio Hatada, Tetsuya Tanaka, Toshiki Iino, Kenichi Kasai +1 more | 1996-04-02 |
| 5365400 | Heat sinks and semiconductor cooling device using the heat sinks | Noriyuki Ashiwake, Toshio Hatsuda, Shizuo Zushi, Satomi Kobayashi | 1994-11-15 |