Issued Patents All Time
Showing 1–6 of 6 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| RE37690 | Lead frame and semiconductor device | Makoto Kitano, Sueo Kawai, Asao Nishimura, Hideo Miura, Akihiro Yaguchi +5 more | 2002-05-07 |
| 5365400 | Heat sinks and semiconductor cooling device using the heat sinks | Noriyuki Ashiwake, Takahiro Daikoku, Shizuo Zushi, Satomi Kobayashi | 1994-11-15 |
| 5276586 | Bonding structure of thermal conductive members for a multi-chip module | Takahiro Daikoku, Tetsuya Hayashida, Noriyuki Ashiwake, Fumiyuki Kobayashi, Keizou Kawamura +1 more | 1994-01-04 |
| 5270572 | Liquid impingement cooling module for semiconductor devices | Tadakatsu Nakajima, Shigeo Ohashi, Heikichi Kuwahara, Noriyuki Ashiwake, Motohiro Sato +6 more | 1993-12-14 |
| 5089936 | Semiconductor module | Hiroyuki Kojima, Takahiro Daikoku, Shizuo Zushi, Fumiyuki Kobayashi | 1992-02-18 |
| 4942452 | Lead frame and semiconductor device | Makoto Kitano, Sueo Kawai, Asao Nishimura, Hideo Miura, Akihiro Yaguchi +5 more | 1990-07-17 |