Issued Patents All Time
Showing 1–22 of 22 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 6987668 | Liquid cooling system and personal computer using thereof | Makoto Kitano, Takashi Naganawa, Yuji Yoshitomi, Rintaro Minamitani, Shigeo Ohashi +2 more | 2006-01-17 |
| 6972954 | Liquid cooling system and personal computer using the same | Rintaro Minamitani, Makoto Kitano, Shigeo Ohashi, Yoshihiro Kondo, Takashi Naganawa +2 more | 2005-12-06 |
| 6873525 | Liquid cooling system and personal computer using the same | Rintaro Minamitani, Makoto Kitano, Shigeo Ohashi, Yoshihiro Kondo, Takashi Naganawa +2 more | 2005-03-29 |
| 6741464 | Liquid cooling system and personal computer using thereof | Makoto Kitano, Takashi Naganawa, Yuji Yoshitomi, Rintaro Minamitani, Shigeo Ohashi +2 more | 2004-05-25 |
| 6697253 | Liquid cooling system and personal computer using thereof | Rintaro Minamitani, Makoto Kitano, Shigeo Ohashi, Yoshihiro Kondo, Takashi Naganawa +2 more | 2004-02-24 |
| 6611425 | Electronic apparatus | Shigeo Ohashi, Takashi Naganawa, Makoto Kitano, Rintaro Minamitani, Yoshihiro Kondo +1 more | 2003-08-26 |
| 6292365 | Electronic apparatus | Toshio Otaguro, Atsuo Nishihara, Mitsuru Honma | 2001-09-18 |
| 5959351 | Liquid-cooled electronic device | Shigeyuki Sasaki, Tadakatsu Nakajima, Yasuo Ohsone, Toshio Hatada, Toshiki Iino +2 more | 1999-09-28 |
| 5774334 | Low thermal resistant, fluid-cooled semiconductor module | Keizo Kawamura, Takahiro Daikoku, Akio Idei, Kenichi Kasai, Hideyuki Kimura +3 more | 1998-06-30 |
| 5751062 | Cooling device of multi-chip module | Takahiro Daikoku, Fumiyuki Kobayashi, Kenichi Kasai, Keizou Kawamura, Akio Idei | 1998-05-12 |
| RE35721 | Cooling device of semiconductor chips | Takahiro Daikoku, Tadakatsu Nakajima, Keizo Kawamura, Motohiro Sato, Fumiyuki Kobayashi +1 more | 1998-02-03 |
| 5705850 | Semiconductor module | Takahiro Daikoku, Kenichi Kasai, Keizou Kawamura, Hideyuki Kimura, Atsuo Nishihara +2 more | 1998-01-06 |
| 5595240 | Cooling apparatus of electronic devices | Takahiro Daikoku, Nobuo Kawasaki, Shizuo Zushi | 1997-01-21 |
| 5515912 | Cooling apparatus of electronic devices | Takahiro Daikoku, Nobuo Kawasaki, Shizuo Zushi | 1996-05-14 |
| 5488255 | Cooling device for semiconductor packages, having flexible film heat expulsion means | Kazuo Sato, Mitsuhiro Shikida, Shigeo Ohashi, Toshio Hatada, Shinji Tanaka +2 more | 1996-01-30 |
| 5406807 | Apparatus for cooling semiconductor device and computer having the same | Tadakatsu Nakajima, Shigeyuki Sasaki, Yasuo Ohsone, Toshio Hatada, Toshiki Iino +2 more | 1995-04-18 |
| 5365400 | Heat sinks and semiconductor cooling device using the heat sinks | Takahiro Daikoku, Toshio Hatsuda, Shizuo Zushi, Satomi Kobayashi | 1994-11-15 |
| 5345107 | Cooling apparatus for electronic device | Takahiro Daikoku, Nobuo Kawasaki, Keizou Kawamura, Shizuo Zushi, Mitsuo Miyamoto +1 more | 1994-09-06 |
| 5276586 | Bonding structure of thermal conductive members for a multi-chip module | Toshio Hatsuda, Takahiro Daikoku, Tetsuya Hayashida, Fumiyuki Kobayashi, Keizou Kawamura +1 more | 1994-01-04 |
| 5270572 | Liquid impingement cooling module for semiconductor devices | Tadakatsu Nakajima, Shigeo Ohashi, Heikichi Kuwahara, Motohiro Sato, Toshio Hatsuda +6 more | 1993-12-14 |
| 5126829 | Cooling apparatus for electronic device | Takahiro Daikoku, Nobuo Kawasaki, Shizuo Zushi | 1992-06-30 |
| 4770242 | Cooling device of semiconductor chips | Takahiro Daikoku, Tadakatsu Nakajima, Keizo Kawamura, Motohiro Sato, Fumiyuki Kobayashi +1 more | 1988-09-13 |