| RE43443 |
Leadframe semiconductor integrated circuit device using the same, and method of and process for fabricating the two |
Yujiro Kajihara, Kazunari Suzuki, Kunihiro Tsubosaki, Hiromichi Suzuki, Yoshinori Miyaki +1 more |
2012-06-05 |
| 6919622 |
Semiconductor device |
Gen Murakami, Kunihiro Tsubosaki, Masahiro Ichitani, Kunihiko Nishi, Ichiro Anjo +19 more |
2005-07-19 |
| 6720208 |
Semiconductor device |
Gen Murakami, Kunihiro Tsubosaki, Masahiro Ichitani, Kunihiko Nishi, Ichiro Anjo +19 more |
2004-04-13 |
| 6531760 |
Semiconductor device |
Gen Murakami, Kunihiro Tsubosaki, Masahiro Ichitani, Kunihiko Nishi, Ichiro Anjo +19 more |
2003-03-11 |
| RE37690 |
Lead frame and semiconductor device |
Makoto Kitano, Asao Nishimura, Hideo Miura, Akihiro Yaguchi, Chikako van Koten nee Kitabayashi +5 more |
2002-05-07 |
| 6326681 |
Semiconductor device |
Gen Murakami, Kunihiro Tsubosaki, Masahiro Ichitani, Kunihiko Nishi, Ichiro Anjo +19 more |
2001-12-04 |
| 6303982 |
Semiconductor device |
Gen Murakami, Kunihiro Tsubosaki, Masahiro Ichitani, Kunihiko Nishi, Ichiro Anjo +19 more |
2001-10-16 |
| 6204552 |
Semiconductor device |
Gen Murakami, Kunihiro Tsubosaki, Masahiro Ichitani, Kunihiko Nishi, Ichiro Anjo +19 more |
2001-03-20 |
| 6130114 |
Semiconductor device |
Gen Murakami, Kunihiro Tsubosaki, Masahiro Ichitani, Kunihiko Nishi, Ichiro Anjoh +19 more |
2000-10-10 |
| 6124629 |
Semiconductor device including a resin sealing member which exposes the rear surface of the sealed semiconductor chip |
Gen Murakami, Kunihiro Tsubosaki, Masahiro Ichitani, Kunihiko Nishi, Ichiro Anjo +19 more |
2000-09-26 |
| 6100115 |
Semiconductor device |
Gen Murakami, Kunihiro Tsubosaki, Masahiro Ichitani, Kunihiko Nishi, Ichiro Anjo +19 more |
2000-08-08 |
| 6100580 |
Semiconductor device having all outer leads extending from one side of a resin member |
Gen Murakami, Kunihiro Tsubosaki, Masahiro Ichitani, Kunihiko Nishi, Ichiro Anjo +19 more |
2000-08-08 |
| 6081023 |
Semiconductor device |
Gen Murakami, Kunihiro Tsubosaki, Masahiro Ichitani, Kunihiko Nishi, Ichiro Anjoh +19 more |
2000-06-27 |
| 6072231 |
Semiconductor device |
Gen Murakami, Kunihiro Tsubosaki, Masahiro Ichitani, Kunihiko Nishi, Ichiro Anjoh +19 more |
2000-06-06 |
| 6069029 |
Semiconductor device chip on lead and lead on chip manufacturing |
Gen Murakami, Kunihiro Tsubosaki, Masahiro Ichitani, Kunihiko Nishi, Ichiro Anjo +19 more |
2000-05-30 |
| 6018191 |
Semiconductor device |
Gen Murakami, Kunihiro Tsubosaki, Masahiro Ichitani, Kunihiko Nishi, Ichiro Anjoh +19 more |
2000-01-25 |
| 5981315 |
Semiconductor device |
Gen Murakami, Kunihiro Tsubosaki, Masahiro Ichitani, Kunihiko Nishi, Ichiro Anjoh +19 more |
1999-11-09 |
| 5914530 |
Semiconductor device |
Gen Murakami, Kunihiro Tsubosaki, Masahiro Ichitani, Kunihiko Nishi, Ichiro Anjoh +19 more |
1999-06-22 |
| 5863817 |
Semiconductor device |
Gen Murakami, Kunihiro Tsubosaki, Masahiro Ichitani, Kunihiko Nishi, Ichiro Anjo +19 more |
1999-01-26 |
| 5821606 |
Semiconductor device |
Gen Murakami, Kunihiro Tsubosaki, Masahiro Ichitani, Kunihiko Nishi, Ichiro Anjo +19 more |
1998-10-13 |
| 5811877 |
Semiconductor device structure |
Ichiro Miyano, Ikuo Kawaguchi, Kunio Matsumoto, Junichi Saeki, Tooru Yoshida +7 more |
1998-09-22 |
| 5793099 |
Semiconductor device |
Gen Murakami, Kunihiro Tsubosaki, Masahiro Ichitani, Kunihiko Nishi, Ichiro Anjoh +19 more |
1998-08-11 |
| 5637913 |
Leadframe semiconductor integrated circuit device using the same and method of and process for fabricating the two |
Yujiro Kajihara, Kazunari Suzuki, Kunihiro Tsubosaki, Hiromichi Suzuki, Yoshinori Miyaki +1 more |
1997-06-10 |
| 5612569 |
Semiconductor device |
Gen Murakami, Kunihiro Tsubosaki, Masahiro Ichitani, Kunihiko Nishi, Ichiro Anjoh +19 more |
1997-03-18 |
| 5530286 |
Semiconductor device |
Gen Murakami, Kunihiro Tsubosaki, Masahiro Ichitani, Kunihiko Nishi, Ichiro Anjoh +19 more |
1996-06-25 |