Issued Patents All Time
Showing 1–12 of 12 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 7830502 | Substrate inspection device and substrate inspection method | Noboru Kato | 2010-11-09 |
| 6185481 | Air cooled electronic equipment apparatus | Yoshihiro Kondou, Tadakatsu Nakajima, Shigeo Ohashi, Masayoshi Miyazaki, Shoohei Fuse +2 more | 2001-02-06 |
| 6156427 | Electroconductive resin composition for molding and electromagnetic wave interference shield structure molded from the composition | Masao Gotoh, Makoto Iida, Kenichi Waragai, Meiichi Ohta | 2000-12-05 |
| 6094343 | Heat dissipation structure for electronic equipment including two heat dissipation block assemblies and a heat conductive coupler | Tsuyoshi Nakagawa, Yasushi Neho, Naoyuki Sakamoto, Shigeo Ohashi, Yoshito Ohmura +4 more | 2000-07-25 |
| 6094344 | Heat dissipation structure for a personal computer including two heat dissipation block assemblies and two heat dissipation plates | Tsuyoshi Nakagawa, Yasushi Neho, Naoyuki Sakamoto, Shigeo Ohashi, Yoshito Ohmura +4 more | 2000-07-25 |
| 5805417 | Heat dissipation structure in a portable computer including a heat dissipation block extending from a heat dissipation plate through a first circuit board to a CPU on a second circuit board | Tsuyoshi Nakagawa, Yasushi Neho, Naoyuki Sakamoto, Shigeo Ohashi, Yoshito Ohmura +4 more | 1998-09-08 |
| 5796580 | Air-cooled information processing apparatus having cooling air fan, sub-fan, and plural separated cooling air flow channels | Toshihiro Komatsu, Hitoshi Matsushima, Toshio Hatada, Tetsuro Homma, Yoshihiro Kondo +7 more | 1998-08-18 |
| 5646824 | Electronic equipment and lap-top type electronic equipment | Shigeo Ohashi, Toshio Hatada, Takeo Tanaka | 1997-07-08 |
| 5428503 | Jet cooling apparatus for cooling electronic equipment and computer having the same mounted thereon | Hitoshi Matsushima, Toshihiro Komatu, Yoshihiro Kondou, Toshio Hatada, Tetsuro Honma +3 more | 1995-06-27 |
| 5358032 | LSI package cooling heat sink, method of manufacturing the same and LSI package to which the heat sink is mounted | Masatsugu Arai, Akiomi Kohno, Toshio Hatada, Yoshihiro Kondo, Toshihiro Komatsu +2 more | 1994-10-25 |
| 5313362 | Packaging structure of small-sized computer | Toshio Hatada, Hiroshi Inouye, Takao Ohba | 1994-05-17 |
| 5077601 | Cooling system for cooling an electronic device and heat radiation fin for use in the cooling system | Toshio Hatada, Takayuki Atarashi, Takahiro Daikoku, Satomi Kobayashi, Shizuo Zushi +1 more | 1991-12-31 |