Issued Patents All Time
Showing 1–25 of 26 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 8816710 | Inspection contact element and inspecting jig | Norihiro Ohta, Manabu Ohmayu | 2014-08-26 |
| 8314624 | Probe card, semiconductor inspecting apparatus, and manufacturing method of semiconductor device | Naoki Okamoto | 2012-11-20 |
| 7956627 | Probe card, semiconductor inspecting apparatus, and manufacturing method of semiconductor device | Naoki Okamoto | 2011-06-07 |
| 7724006 | Probe card, manufacturing method of probe card, semiconductor inspection apparatus and manufacturing method of semiconductor device | Yasunori Narizuka | 2010-05-25 |
| 7656174 | Probe cassette, semiconductor inspection apparatus and manufacturing method of semiconductor device | Yasunori Narizuka | 2010-02-02 |
| 7541202 | Connection device and test system | Terutaka Mori, Akihiko Ariga, Hidetaka Shigi, Takayoshi Watanabe, Ryuji Kono | 2009-06-02 |
| 7534629 | Manufacturing method of semiconductor integrated circuit device | Teruo Shoji, Akio Hasebe, Yoshinori Deguchi, Motoji Murakami, Masayoshi Okamoto +1 more | 2009-05-19 |
| 7423439 | Probe sheet adhesion holder, probe card, semiconductor test device, and manufacturing method of semiconductor device | Teruo Shoji, Akio Hasebe, Yoshinori Deguchi, Yasunori Narizuka | 2008-09-09 |
| 7420380 | Probe card and semiconductor testing device using probe sheet or probe card semiconductor device producing method | Takeshi Yamamoto | 2008-09-02 |
| 7390732 | Method for producing a semiconductor device with pyramidal bump electrodes bonded onto pad electrodes arranged on a semiconductor chip | Takayoshi Watanabe, Hidetaka Shigi, Terutaka Mori | 2008-06-24 |
| 7351597 | Fabrication method of semiconductor integrated circuit device | Yuji Wada, Takehiko Hasebe, Yasunori Narizuka, Akira Yabushita, Terutaka Mori +4 more | 2008-04-01 |
| 7285430 | Connection device and test system | Terutaka Mori, Akihiko Ariga, Hidetaka Shigi, Takayoshi Watanabe, Ryuji Kono | 2007-10-23 |
| 7227370 | Semiconductor inspection apparatus and manufacturing method of semiconductor device | — | 2007-06-05 |
| 7219422 | Fabrication method of semiconductor integrated circuit device | Yuji Wada, Takehiko Hasebe, Yasunori Narizuka, Akira Yabushita, Terutaka Mori +4 more | 2007-05-22 |
| 7198962 | Semiconductor device and manufacturing method thereof including a probe test step and a burn-in test step | Ryuji Kohno, Tetsuo Kumazawa, Makoto Kitano, Akihiko Ariga, Yuji Wada +7 more | 2007-04-03 |
| 7049837 | Probe sheet, probe card, semiconductor test equipment and semiconductor device fabrication method | Takehiko Hasebe, Yasunori Narizuka, Akio Hasebe | 2006-05-23 |
| 6900646 | Probing device and manufacturing method thereof, as well as testing apparatus and manufacturing method of semiconductor with use thereof | Akio Hasebe | 2005-05-31 |
| 6759258 | Connection device and test system | Terutaka Mori, Akihiko Ariga, Hidetaka Shigi, Takayoshi Watanabe, Ryuji Kono | 2004-07-06 |
| 6617863 | Probing device and manufacturing method thereof, as well as testing apparatus and manufacturing method of semiconductor with use thereof | Akio Hasebe | 2003-09-09 |
| 6566150 | Semiconductor device and manufacturing method thereof including a probe test step and a burn-in test step | Ryuji Kohno, Tetsuo Kumazawa, Makoto Kitano, Akihiko Ariga, Yuji Wada +7 more | 2003-05-20 |
| 6455335 | Semiconductor device and manufacturing method thereof including a probe test step and a burn-in test step | Ryuji Kohno, Tetsuo Kumazawa, Makoto Kitano, Akihiko Ariga, Yuji Wada +7 more | 2002-09-24 |
| 6305230 | Connector and probing system | Terutaka Mori, Akihiko Ariga, Hidetaka Shigi, Takayoshi Watanabe, Ryuji Kono | 2001-10-23 |
| 6197603 | Semiconductor device and manufacturing method thereof including a probe test step and a burn-in test step | Ryuji Kohno, Tetsuo Kumazawa, Makoto Kitano, Akihiko Ariga, Yuji Wada +7 more | 2001-03-06 |
| 5191708 | Manufacturing method of a probe head for semiconductor LSI inspection apparatus | Ryuichi Takagi | 1993-03-09 |
| 4952272 | Method of manufacturing probing head for testing equipment of semi-conductor large scale integrated circuits | Hironobu Okino, Akio Fujiwara, Yutaka Akiba, Tsuyoshi Fujita, Masao Mitani +1 more | 1990-08-28 |