Issued Patents All Time
Showing 1–5 of 5 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 6506982 | Multi-layer wiring substrate and manufacturing method thereof | Hidetaka Shigi, Naoya Kitamura, Masashi Nishiki, Tetsuya Yamazaki, Takehiko Hasebe +1 more | 2003-01-14 |
| 5388328 | Process for fabricating an interconnected multilayer board | Hitoshi Yokono, Hideo Arima, Takashi Inoue, Naoya Kitamura, Haruhiko Matsuyama +4 more | 1995-02-14 |
| 5300735 | Interconnected multilayer boards and fabrication processes thereof | Hitoshi Yokono, Hideo Arima, Takashi Inoue, Naoya Kitamura, Haruhiko Matsuyama +4 more | 1994-04-05 |
| 5182121 | Hot press | Akimi Miyashita, Mutsumasa Fujii, Minoru Kubosawa, Keiichiro Torii, Nobuaki Ooki +3 more | 1993-01-26 |
| 4908087 | Method of forming a multilayer printed circuit board and apparatus therefor | Hideyasu Murooka, Osamu Yamada, Noriaki Ujiie | 1990-03-13 |