Patent Leaderboard
USPTO Patent Rankings Data through Dec 31, 2025
Home › Semiconductor device, lead-patterning substrate, and electronics device, and method for fabricating same

Semiconductor device, lead-patterning substrate, and electronics device, and method for fabricating same

US Patent 6433409 · Granted Aug 13, 2002

Estimated economic value: $95,000 ⓘ

Assignee

Inventors

View full patent text on Google Patents →

More Patents by These Inventors

Method for fabricating an electronic device substrate2012
Electronic device substrate and its fabrication method, and electronic device an2012
Lead frame, method of making the same and light receiving/emitting device2011
Method for fabricating a multilayer wiring board, multilayer wiring board, and e2010
Light emitting device having a mirror portion2009
Light-emitting unit and method for producing same as well as lead frame used for2008
Wiring board, method for manufacturing wiring board and electronic component usi2007
Circuit tape having adhesive film semiconductor device and a method for manufact2007
Wiring tape for semiconductor device including a buffer layer having interconnec2006
Light-emitting unit and method for producing same as well as lead frame used for2006
Surface package type semiconductor package and method of producing semiconductor2006
Semiconductor device2005