Patent Leaderboard
USPTO Patent Rankings Data through Dec 31, 2025
Home › Surface package type semiconductor package and method of producing semiconductor memory

Surface package type semiconductor package and method of producing semiconductor memory

US Patent 6981585 · Granted Jan 3, 2006

Estimated economic value: $217,000 ⓘ

Assignee

Inventors

View full patent text on Google Patents →

More Patents by These Inventors

Table game device2024
Semiconductor device having a liquid cooling module2015
Semiconductor device having a liquid cooling module2014
Semiconductor device having an improved connection arrangement between a semicon2013
Wafer of circuit board and joining structure of wafer or circuit board2012
Semiconductor device having an improved connection arrangement between a semicon2012
Semiconductor device having an improved connection arrangement between a semicon2011
Semiconductor device having an improved connected arrangement between a semicond2010
Semiconductor device having an improved connection arrangement between a semicon2010
Method of manufacturing semiconductor device2010
Semiconductor device having an improved connection arrangement between a semicon2010
Method for manufacturing a three-dimensional semiconductor device and a wafer us2010