Issued Patents All Time
Showing 1–4 of 4 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 5289039 | Resin encapsulated semiconductor device | Yoshihiro Ishida, Katsuji Komatsu, Seiichi Mimura, Isao Yabe, Shingo Ichikawa +1 more | 1994-02-22 |
| 5233225 | Resin encapsulated pin grid array and method of manufacturing the same | Yoshihiro Ishida, Katsuji Komatsu, Seiichi Mimura, Isao Yabe, Shingo Ichikawa +1 more | 1993-08-03 |
| 5179039 | Method of making a resin encapsulated pin grid array with integral heatsink | Yoshihiro Ishida, Katsuji Komatsu, Seiichi Mimura, Isao Yabe, Shingo Ichikawa +1 more | 1993-01-12 |
| 5108955 | Method of making a resin encapsulated pin grid array with integral heatsink | Yoshihiro Ishida, Katsuji Komatsu, Seiichi Mimura, Isao Yabe, Shingo Ichikawa +1 more | 1992-04-28 |