Issued Patents All Time
Showing 1–13 of 13 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| D399001 | Adapter for hearing aid | Akira Yanagisawa, Toshibumi Wakayama | 1998-09-29 |
| D397796 | Hearing aid | Akira Yanagisawa, Toshibumi Wakayama | 1998-09-01 |
| 5783134 | Method of resin-sealing semiconductor device | Masahiko Yoneyama, Teruo Nayuki, Hiroaki Shimizu, Katsuhiko Ikai, Kazuhiko Asaumi | 1998-07-21 |
| 5769218 | Storage and safety device for article being stored | — | 1998-06-23 |
| 5476629 | Method for manufacturing IC card substrate | Kazuo Sato, Hajime Omata | 1995-12-19 |
| 5289039 | Resin encapsulated semiconductor device | Yoshihiro Ishida, Katsuji Komatsu, Seiichi Mimura, Kikuo Takenouchi, Shingo Ichikawa +1 more | 1994-02-22 |
| 5233225 | Resin encapsulated pin grid array and method of manufacturing the same | Yoshihiro Ishida, Katsuji Komatsu, Seiichi Mimura, Kikuo Takenouchi, Shingo Ichikawa +1 more | 1993-08-03 |
| 5179039 | Method of making a resin encapsulated pin grid array with integral heatsink | Yoshihiro Ishida, Katsuji Komatsu, Seiichi Mimura, Kikuo Takenouchi, Shingo Ichikawa +1 more | 1993-01-12 |
| 5126184 | Molded part and mold for manufacturing the same | Takashi Odaka, Minoru Fukuda, Masao Mafune | 1992-06-30 |
| 5108955 | Method of making a resin encapsulated pin grid array with integral heatsink | Yoshihiro Ishida, Katsuji Komatsu, Seiichi Mimura, Kikuo Takenouchi, Shingo Ichikawa +1 more | 1992-04-28 |
| 4994659 | IC card | Yoshihiro Shimada, Kazumi Machida, Hiroyuki Kaneko | 1991-02-19 |
| 4954308 | Resin encapsulating method | Katsuji Komatsu, Hiroyuki Kaneko | 1990-09-04 |
| 4213293 | Receiving unit for timepieces | Hiroshi Mabuchi | 1980-07-22 |