Issued Patents All Time
Showing 1–4 of 4 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 5435877 | Process for the production of copper-clad laminate | Kenji Ishii, Yoshinori Kondo, Hiroyuki Matsumoto | 1995-07-25 |
| 5368921 | Metal foil-clad laminate having surface smoothness | Kenji Ishii, Hiroyuki Matsumoto | 1994-11-29 |
| 5242540 | Process for producing thin copper foil-clad circuit board substrate | Kenji Ishii, Hiroyuki Matsumoto, Kenichi Moriyama | 1993-09-07 |
| 5160787 | Electrical laminate having ability to absorb ultraviolet rays | Morio Gaku, Kenzi Ishii | 1992-11-03 |