Issued Patents All Time
Showing 1–3 of 3 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 7232528 | Surface treatment agent for copper and copper alloy | Akira Hosomi, Naoki Kogure, Kenichi Takahashi, Atsushi Hosoda, Kazuhiko Ikeda | 2007-06-19 |
| 5802901 | Process for correcting the distortion of electrolytic seed plates | Hirohisa Oda, Masamichi Miyauchi, Akinori Miura, Tsuneo Funahashi, Yukihisa Moriya +1 more | 1998-09-08 |
| 5242540 | Process for producing thin copper foil-clad circuit board substrate | Kenji Ishii, Takamasa Nakai, Hiroyuki Matsumoto | 1993-09-07 |